IP Library Granted Patent US 7,711,229
Granted Patent B2
US 7,711,229 · App. 11/843,682 · Granted May 4, 2010

Optical integrated device and manufacturing method thereof

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Quick Facts
Patent No.
US 7,711,229
App. No.
11/843,682
Granted
May 4, 2010
Kind
B2
Abstract

In the optical integrated devices with ridge waveguide structure based on the conventional technology, there occur such troubles as generation of a recess in a BJ section to easily cause a crystal defect due to the mass transport phenomenon of InP when a butt joint (BJ) is grown, lowering of reliability of the devices, and lowering in a yield in fabrication of devices. In the present invention, a protection layer made of InGaAsP is provided on the BJ section. The layer has high etching selectivity for the InP cladding layer and remains on the BJ section even after mesa etching.

Claims (10)

1. An optical integrated device with ridge waveguide structure comprising:

an optical waveguide region in which a first optical waveguide layer and a second optical waveguide layer are integrated with each other by a butt joint at least at one portion on a semiconductor substrate;

and upper and lower cladding layers respectively positioned above and under the optical waveguide region for confining the light therein;

wherein, in a region in which the upper cladding layer is removed for forming a mesa structure of a ridge waveguide, a protection layer is formed between the optical waveguide region and the upper cladding layer to override the butt joint of the first optical waveguide layer and the second optical waveguide layer and to cover at least a portion or all of the butt joint;

wherein the protection layer is formed in the upper cladding layer.

2. The optical integrated device with ridge waveguide structure according to claim 1 , wherein the protection layer is formed on an edge portion of the first optical waveguide layer and on an entire region of the second optical waveguide layer.

3. The optical integrated device with ridge waveguide structure according to claim 1 , wherein, at the butt joint between the first optical waveguide layer and the second optical waveguide layer, an edge of the protection layer extends over a surface of the first optical waveguide layer by a distance from 0.01 μm to 10 μm from the butt joint.

4. The optical integrated device with ridge waveguide structure according to claim 1 , wherein the first optical waveguide layer consists of multiple quantum well structures emitting or absorbing light, and the second optical waveguide layer consists of a semiconductor bulk layer for propagating light therethrough.

5. The optical integrated device with ridge waveguide structure according to claim 1 , wherein materials for forming the first and the second optical waveguide layers and the protection layer consist of a III-V semiconductor material having atoms that are selected from In, Ga, Al, As, P, Sb, and N.

6. The optical integrated device with ridge waveguide structure according to claim 1 , wherein the protection layer on an edge portion of the bull joint is extended aside from the first optical waveguide layer and the second waveguide layer.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: LUMENTUM JAPAN, INC.
To: LUMENTUMRADIANT GMBH
Reel/Frame 073971/0379 →
CHANGE OF NAME Recorded Jul 2, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 049669/0609 →
CHANGE OF NAME Recorded Dec 3, 2014
From: OPNEXT JAPAN, INC.
To: OCLARO JAPAN, INC.
Reel/Frame 034524/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 29, 2007
From: KITATANI, TAKESHI; SHINODA, KAZUNORI; SHIOTA, TAKASHI; MAKINO, SHIGEKI; FUKAMACHI, TOSHIHIKO
To: OPNEXT JAPAN, INC.
Reel/Frame 019761/0024 →