Apparatus for tool-less removal of PCB assembly
View Patent ↗Apparatus for removing a printed circuit board (PCB) and bezel assembly from a unit includes a pull spring is attached to opposing sides of the PCB and bezel assembly. Each pull spring includes a generally M-shaped spring. A first end of the M-shaped spring includes a first pin carrying a knob. The first pin extends through an opening in the bezel and the knob is disposed within a recessed portion of the bezel and is generally flush with a front face of the bezel with the M-shaped spring compressed in a normal constrained position. In an extended position when the M-shaped springs return to a substantially uncompressed state, the knobs are pushed forward and are spaced apart in front of the bezel, enabling a person to grip and pull each knob to remove the PCB and bezel assembly from the unit in which it is installed.
1. Apparatus for removing a printed circuit board (PCB) and bezel assembly from a unit comprising:
a pair of pull springs; said pull springs being attached to opposing sides of the PCB and bezel assembly;
each said pull spring being a unitary member and including a compressible spring portion;
said compressible spring portion including a first end with a first pin extending through the bezel and carrying a knob in front of the bezel; and a second end of said compressible spring portion being attached with the PCB and bezel assembly;
in a constrained position, said first pin extending through an opening in the bezel and said knob being disposed within the bezel recessed portion and said compressible spring portion being compressed;
in an extended position, said compressible spring portion returning to a substantially uncompressed state, said knobs being pushed forward, spaced apart in front of the bezel, enabling a user access to each knob to remove the PCB and bezel assembly.
2. The apparatus for removing a printed circuit board (PCB) and bezel assembly as recited in claim 1 wherein said compressible spring portion includes a generally M-shaped spring.
3. The apparatus for removing a printed circuit board (PCB) and bezel assembly as recited in claim 1 wherein said pull spring is formed by injection molding.
4. The apparatus for removing a printed circuit board (PCB) and bezel assembly as recited in claim 1 wherein said pull spring is formed of an electrically nonconductive material including properties for retaining spring force.
5. The apparatus for removing a printed circuit board (PCB) and bezel assembly as recited in claim 1 wherein said pull spring is formed of a plastic material.
6. The apparatus for removing a printed circuit board (PCB) and bezel assembly as recited in claim 1 wherein said pull spring is formed of an unreinforced, flame-retarded, Polypropylene material.