Method of scribing stuck mother substrate and method of dividing stuck mother substrate
View Patent ↗There is provided a method of scribing a stuck mother substrate for obtaining a plurality of stuck substrates formed by sticking a first square substrate and a second square substrate together so that one side of opposing two sides of the square substrates is aligned and the other side is not aligned so that the first substrate is set back to the second substrate from a stuck mother substrate in which a first mother substrate and a second mother substrate are stuck together. In the method of scribing a stuck mother substrate, the second mother substrate is strongly scribed for a full scribe line and the first mother substrate is strongly scribed for a half scribe line. On the other hand, the first mother substrate is weakly scribed for the full scribe line.
1. A method of scribing a stuck mother substrate in order to obtain a plurality of stuck substrates from a stuck mother substrate in which a first mother substrate and a second mother substrate are stuck together, where the plurality of stuck substrates includes a first square of the first mother substrate and a second square of the second mother substrate stuck together so that one side of each of the square substrates are aligned while the other sides of each of the square substrates are not aligned so that unaligned side of the first mother substrate is offset from the unaligned side of the second mother substrate, the method of scribing the stuck mother substrate comprising:
performing a first scribe process at a first predetermined strength on the second mother substrate which is stuck to the first mother substrate to form a full scribe line forming the unaligned side of the second substrate and to form a half scribe line which forms the unaligned side of the first mother substrate, the half scribe line being offset in a lateral direction from the full scribe line; and
performing a second scribe process on the first mother substrate at a second predetermined strength which is weaker than the first predetermined strength in order to form a full scribe line to form the aligned side of the first substrate.
2. A method of scribing a stuck mother substrate in order to obtain a plurality of stuck substrates from a stuck mother substrate in which a first mother substrate and a second mother substrate are stuck together, where the plurality of stuck substrates includes a first square of the first mother substrate and a second square of the second mother substrate stuck together so that one side of each of the square substrates are aligned while the other sides of each of the square substrates are not aligned so that unaligned side of the first mother substrate is offset from the unaligned side of the second mother substrate, the method of scribing the stuck mother substrate comprising:
performing a first scribe process at a first predetermined strength on the first mother substrate and second mother substrate to form a full scribe line which forms the aligned sides of the first and second substrates; and
performing a second scribe process on the first mother substrate to form a half scribe line which forms the unaligned side of the first substrate which is offset in a lateral direction from the full scribe line formed in the first scribe process.
3. The method of scribing a stuck mother substrate according to claim 1 , wherein the first substrate and the second substrate are stuck together so that the other two sides except the opposing two sides are aligned in the stuck substrate.
4. The method of scribing a stuck mother substrate according to claim 1 , wherein the first substrate and the second substrate are stuck together so that one side is aligned and the other side is free from alignment so that the first substrate is set back to the second substrate in the other two sides except the opposing two sides in the stuck substrate.
5. The method of scribing a stuck mother substrate according to claim 1 , wherein the first mother substrate and the second mother substrate are each a disciform glass substrate.
6. The method of scribing a stuck mother substrate according to claim 1 , wherein the stuck substrate is a TFT liquid crystal panel and the stuck mother substrate is an ODF mother substrate.
7. A method of dividing a stuck mother substrate comprising: performing the method of scribing a stuck mother substrate described in claim 1 ; and
breaking the stuck mother substrate along the full scribe line and the half scribe line to obtain a plurality of the stuck substrates in which a needless chip corresponding to the set back portion is attached.
8. The method of dividing a stuck mother substrate according to claim 7 , further comprising:
breaking the needless chip from the each stuck substrate in which the needless chip is attached after breaking the stuck mother substrate.