Method of making a top-emitting OLED device having improved power distribution

1. A method of making a top-emitting LED device, comprising:

a) providing, over a substrate a laterally spaced and optically opaque lower electrode and an upper electrode bus that is electrically insulated from the lower electrode;

b) depositing material forming an EL medium structure over the lower electrode and the upper electrode bus;

c) depositing, over the EL medium structure, a first light-transmissive upper electrode that protects the EL medium structure from particulate contamination;

d) selectively removing the first light-transmissive upper electrode and most of the EL medium structure over a selective portion of the upper electrode bus; and

e) depositing a second light-transmissive upper electrode over and in direct electrical contact with the first light-transmissive upper electrode so that such second upper electrode is in electrical contact with at least an upper surface of the upper electrode bus.

2. The method of claim 1 , wherein the step of selectively removing reveals at least upper surfaces of the upper electrode bus.

3. The method of claim 1 , wherein the second light-transmissive upper electrode is thicker than the first light-transmissive upper electrode.

4. The method of claim 1 wherein the step of selectively removing the EL medium structure over a selective portion of the upper electrode bus causes the first upper electrode to become in electrical contact with at least an upper surface of the upper electrode bus.

5. The method of claim 1 wherein the step of selectively removing the EL medium structure includes ablating the material of the EL medium structure.

6. The method of claim 5 wherein the material of the EL medium structure is heated to ablate the material.

7. The method of claim 6 wherein the step of heating is done by localized exposure to a laser beam.

8. The method of claim 1 wherein the material of the EL medium structure is contained between the first light-transmissive upper electrode and the upper electrode bus when the EL medium structure is selectively removed.

9. A method of making a top-emitting LED device, comprising:

a) providing, over a substrate, a laterally spaced and optically opaque lower electrode and an upper electrode bus that is electrically insulated from the lower electrode;

b) depositing material forming an EL medium structure over the lower electrode and the upper electrode bus;

c) depositing, over the EL medium structure, a first light-transmissive upper electrode that protects the EL medium structure from particulate contamination;

d) selectively removing the first light-transmissive upper electrode and most of the EL medium structure over a selective portion of the upper electrode bus;

e) forming a heat-absorbing element over or under the EL medium structure in the area where the EL medium structure is to be selectively removed; and

f) wherein the heat-absorbing element is formed on the upper electrode bus.

10. The method of claim 1 wherein the step of selectively removing the EL medium structure includes one or more of the steps of: heating, exposure to a reactive gas, exposure to a reactive chemical, mechanically removing particles, and exposure to reactive particles.

11. The method of claim 1 wherein the lower electrode and the upper electrode bus are concurrently formed.

12. The method of claim 1 further including providing electrically insulating material between the upper electrode bus and the lower electrode.

13. The method of claim 1 further including providing a common electrical connection to the upper or lower electrode.

14. The method of claim 1 further comprising:

i) providing a laser-light beam directed towards the upper electrode bus; and

ii) providing relative motion between the laser-light beam and the upper electrode bus deposited over the substrate.

15. The method of claim 1 further including:

i) providing a source of uniform radiation directed towards the EL medium structure; and

ii) providing a mask between the source and the EL medium structure and having mask openings corresponding to the location of the upper electrode bus.

16. The method of claim 9 wherein the heat-absorbing element is electrically conductive or black.