Semiconductor device and methods of manufacturing semiconductor devices
This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip wherein the molded body comprises an array of recesses in a first surface of the molded body, first contact elements, and elastic elements in the recesses that connect the first contact elements with the molded body.
1. A semiconductor device comprising:
a semiconductor chip;
a molded body covering the semiconductor chip, the molded body comprising an array of recesses in a first surface of the molded body;
first contact elements; and
elastic elements in the recesses that connect the first contact elements with the molded body, the elastic elements directly contacting the molded body.
2. The semiconductor device according to claim 1 , wherein each first contact element comprises a solder bump.
3. The semiconductor device according to claim 1 , further comprising:
second contact elements rigidly connected to the semiconductor chip.
4. The semiconductor device according to claim 3 , wherein the first contact elements and the second contact elements define a common plane for mounting the semiconductor device to a carrier.
5. The semiconductor device according to claim 1 , wherein each elastic element is form-fit to the shape of its respective recess.
6. The semiconductor device according to claim 1 , wherein the elastic elements have an elastic module of less than 50 MPa.
7. The semiconductor device according to claim 1 , further comprising:
conducting lines for electrically connecting the semiconductor chip to the first contact elements.
8. The semiconductor device according to claim 7 , wherein the conducting lines extend over the semiconductor chip and the molded body.
9. The semiconductor device according to claim 1 , wherein the first contact elements comprise at least one of solder bumps, stud bumps, pads, posts, pillars, conductive paste balls, paste bumps, coated polymer balls, and electrically conducting protrusions.
10. A semiconductor device comprising:
a semiconductor chip comprising connection elements on a first main face of the semiconductor chip;
a molded body covering the semiconductor chip, the molded body comprising multiple recesses;
elastic elements in the recesses, the elastic elements directly contacting the molded body;
first contact elements connected to the elastic elements; and
conducting lines applied over the semiconductor chip and a surface of the molded body, the conducting lines electrically connecting the first contact elements with the connection elements.
11. The semiconductor device according to claim 10 , wherein each of the first contact elements is a solder bump.
12. The semiconductor device according to claim 1 , wherein the elastic elements comprise one of silicone and foam.
13. The semiconductor device according to claim 1 , wherein the elastic elements have one of a truncated cone shape, a column shape, and a cubical shape.
14. The semiconductor device according to claim 10 , wherein the elastic elements comprise one of silicone and foam.
15. The semiconductor device according to claim 10 , wherein the elastic elements have one of a truncated cone shape, a column shape, and a cubical shape.
16. A semiconductor device comprising:
a semiconductor chip;
a molded body covering the semiconductor chip, the molded body comprising an array of recesses in a first surface of the molded body;
an elastic element in each recess directly contacting the molded body and form-fit to the shape of the respective recess, each elastic element having a surface coplanar with the first surface of the molded body; and
a first contact element connected to each elastic element.
17. The semiconductor device according to claim 16 , further comprising:
conducting lines electrically coupling the semiconductor chip to each first contact element, the conducting lines extending over the semiconductor chip and directly contacting the first surface of the molded body.
18. The semiconductor device according to claim 16 , further comprising:
second contact elements rigidly connected to the molded body.
19. The semiconductor device according to claim 16 , wherein the elastic elements comprise one of silicone and foam.
20. The semiconductor device according to claim 16 , wherein the elastic elements have one of a truncated cone shape, a column shape, and a cubical shape.