IP Library Granted Patent US 7,740,515
Granted Patent B2
US 7,740,515 · App. 11/850,928 · Granted Jun 22, 2010

Flat panel display and method of fabricating the same

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Quick Facts
Patent No.
US 7,740,515
App. No.
11/850,928
Granted
Jun 22, 2010
Kind
B2
Abstract

A light-emitting display device the same includes an insulating substrate having a thin film transistor formed thereon. The thin film transistor includes a source electrode and/or a drain electrode. A passivation layer is formed on the insulating substrate over at least a portion of the thin film transistor, and has a via hole formed therein, which electrically contacts either the source electrode or the drain electrode. A pixel electrode is formed in the via hole. A light-blocking layer is formed over an entire upper surface of the passivation layer except for an area corresponding to the pixel electrode. A planarization layer is formed on an upper surface of the light-blocking layer except for an area corresponding to the pixel electrode.

Claims (10)

1. A method for fabricating a flat panel display, comprising:

forming a passivation layer over an entire surface of a substrate;

forming a light-blocking layer on an entire surface of the passivation layer;

forming a mask layer on the light-blocking layer, the mask layer having one or more regions corresponding to a first via hole and to a light-blocking shield recess; and

etching the light-blocking layer and the passivation layer to form therein the first via hole and the light-blocking shield recess, wherein both the first via hole and the light-blocking shield recess expose the light-blocking layer.

2. The method of claim 1 , further comprising:

forming a second insulating layer on an entire surface of the light-blocking layer including the first via hole and the light-blocking shield recess;

forming a second mask layer on the second insulating layer, the second mask layer including a region corresponding to the first via hole; and

etching a region of the second insulating layer corresponding to the first via hole.

3. The method of claim 2 , further comprising forming a pixel electrode in the first via hole, connecting to a first electrode through the first via hole.

Assignments (2)
MERGER Recorded Aug 29, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028868/0359 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2008
From: SAMSUNG SDI CO., LTD.
To: SAMSUNG MOBILE DISPLAY CO., LTD.
Reel/Frame 022024/0026 →