IP Library Granted Patent US 7,879,269
Granted Patent B1
US 7,879,269 · App. 11/854,760 · Granted Feb 1, 2011

Ferrite powder optimized for fabrication of ferrite features and related methods

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Quick Facts
Patent No.
US 7,879,269
App. No.
11/854,760
Granted
Feb 1, 2011
Kind
B1
Abstract

The present invention pertains to a method for manufacturing a ferrite powder for use in making PCB ferrite features. The ferrite powder is easily applied and provides a high ferrite-packing factor. The ferrite powder is a mixture of varying sizes of ferrite particles, an epoxy powder, and curing agent powder.

Claims (27)

1. A method for manufacturing coarse ferrite particles and finer ferrite particles to be used in making a ferrite powder, comprising:

providing various sized ferrite particles;

selecting ones of the various sized ferrite particles below a predetermined approximate size as relatively coarse ferrite particles;

grinding ones of the various sized ferrite particles above the predetermined approximate size to create relatively finer ferrite particles; and

mixing the relatively course ferrite particles, the relatively finer ferrite particles, an epoxy powder, and a curing agent powder to create a ferrite powder.

2. The method of claim 1 wherein one of the group consisting of the epoxy powder and a mixture of the epoxy powder and the curing agent powder is mixed with the ferrite particles during the grinding of the ferrite particles above the predetermined size.

3. The method of claim 1 wherein the ferrite powder comprises up to approximately 40% of the relatively finer ferrite particles by weight.

4. The method of claim 1 wherein the relatively finer ferrite particles are around about 1 μm in size.

5. The method of claim 1 wherein the relatively coarse ferrite particles are approximately 10 μm-190 μm in size.

6. The method of claim 1 wherein a majority of the relatively finer ferrite particles are an order of magnitude or less smaller than a majority of the relatively coarse ferrite particles.

7. A method comprising:

creating a ferrite powder mixture of relatively course ferrite particles, relatively finer ferrite particles, an epoxy powder, and a curing agent powder by:

providing sintered ferrite particles;

selecting ones of the sintered ferrite particles below a predetermined approximate size as the relatively coarse ferrite particles;

grinding ones of the sintered ferrite particles above the predetermined approximate size to create the relatively finer ferrite particles; and

mixing one of the group consisting of the epoxy powder and a mixture of the epoxy powder and the curing agent powder with the relatively finer ferrite particles during the grinding of the sintered ferrite particles above a predetermined size;

pressing the ferrite powder mixture into a mold; and

heating the powder mixture to cure to create a ferrite element.

8. The method of claim 7 wherein the relatively finer ferrite particles comprise ferrite particles substantially below the size of the relatively coarse ferrite particles.

9. The method of claim 7 wherein the curing agent powder is approximately 2%-5% of the epoxy powder and the curing agent powder combined.

10. The method of claim 7 wherein the curing agent powder is approximately 0.5% to 10% of the epoxy powder and curing agent powder combined.

11. The method of claim 7 wherein the curing agent powder and the epoxy powder are approximately 5%-12% of the ferrite powder.

12. The method of claim 7 wherein the curing agent powder and epoxy powder are approximately 7% of the ferrite powder.

13. The method of claim 7 further comprising removing the ferrite element from the mold.

14. The method of claim 7 further comprising machining the ferrite element to a particular shape or size.

15. The method of claim 7 wherein the ferrite element is heated to cure prior to removing the ferrite element from the mold.

16. The method of claim 7 wherein the ferrite element is heated to cure after removing the ferrite element from the mold.

Assignments (5)
MERGER Recorded Jun 16, 2016
From: RF MICRO DEVICES, INC.
To: QORVO US, INC.
Reel/Frame 039196/0941 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS (RECORDED 3/19/13 AT REEL/FRAME 030045/0831) Recorded Mar 30, 2015
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: RF MICRO DEVICES, INC.
Reel/Frame 035334/0363 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Mar 19, 2013
From: RF MICRO DEVICES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 030045/0831 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2007
From: DENING, DAVID C.
To: RF MICRO DEVICES, INC.
Reel/Frame 019822/0436 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2007
From: INGS, JOHN BERNARD; ERINS, PETERS VALDEMARS
To: CERAMIC MAGNETICS, INC.
Reel/Frame 019822/0476 →