IP Library Granted Patent US 7,696,027
Granted Patent B2
US 7,696,027 · App. 11/856,450 · Granted Apr 13, 2010

Method of fabricating display substrate and method of fabricating display panel using the same

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Quick Facts
Patent No.
US 7,696,027
App. No.
11/856,450
Granted
Apr 13, 2010
Kind
B2
Abstract

Disclosed is a method of fabricating a display substrate. A black matrix and a color filter layer are formed on a base substrate, and then a transparent electrode and a photoresist layer pattern are sequentially formed. The transparent electrode is patterned using the photoresist layer pattern as a mask to form a common electrode, and a spacer is formed using the photoresist layer pattern.

Claims (34)

1. A method of fabricating a display substrate, the method comprising:

forming a color filter layer on a base substrate;

forming a transparent electrode on the color filter layer;

forming a photoresist layer pattern on the transparent electrode;

patterning the transparent electrode using the photoresist layer pattern as a mask to form a common electrode; and

forming a spacer using the photoresist layer pattern.

2. The method of claim 1 , wherein forming the photoresist layer pattern comprises:

forming a photoresist layer on the transparent electrode;

disposing a slit mask above the photoresist layer, the slit mask comprising a blocking portion which blocks light, a transmitting portion which allows light to pass therethrough and a slit portion which allows light to partially pass therethrough; and

patterning the photoresist layer through an exposure process using the slit mask.

3. The method of claim 2 , wherein the photoresist layer pattern has a first thickness in a first region corresponding to the slit portion, and is removed in a second region corresponding to the transmitting portion.

4. The method of claim 3 , wherein the transparent electrode is patterned through a first etching process using the photoresist layer pattern as a mask.

5. The method of claim 4 , wherein a portion of the transparent electrode, which is exposed in the second region, is removed through the first etching process.

6. The method of claim 5 , wherein forming the spacer using the photoresist layer pattern comprises partially removing the photoresist layer pattern through a second etching process.

7. The method of claim 6 , wherein the photoresist layer pattern is etched by the first thickness through the second etching process.

8. The method of claim 6 , wherein the spacer is formed at a region corresponding to the blocking portion.

9. The method of claim 8 , wherein the photoresist layer is a positive type, in which a region of the photoresist layer exposed to light is removed.

10. A method of fabricating a display panel, the method comprising:

forming a color filter layer on a first base substrate;

forming a transparent electrode on the color filter layer;

forming a photoresist layer pattern on the transparent electrode;

patterning the transparent electrode using the photoresist layer pattern as a mask to form a common electrode;

forming a spacer using the photoresist pattern;

forming a thin film transistor and a pixel electrode connected to the thin film transistor on a second base substrate; and

coupling the first base substrate to the second base substrate such that the first base substrate faces the second base substrate.

11. The method of claim 10 , wherein forming the photoresist layer pattern comprises:

forming a photoresist layer on the transparent electrode;

disposing a slit mask above the photoresist layer, the slit mask comprising a blocking portion which blocks light, a transmitting portion which allows light to pass therethrough and a slit portion which allows light to partially pass therethrough above the photoresist layer; and

patterning the photoresist layer through an exposure process using the slit mask.

12. The method of claim 11 , wherein the photoresist layer pattern has a first thickness in a first region corresponding to the slit portion, and is removed in a second region corresponding to the transmitting portion.

13. The method of claim 12 , wherein the transparent electrode is patterned through a first etching process using the photoresist layer pattern as a mask.

14. The method of claim 13 , wherein forming the spacer using the photoresist layer pattern comprises partially removing the photoresist layer pattern through a second etching process.

15. The method of claim 14 , the spacer is formed at a region corresponding to the thin film transistor.

16. The method of claim 15 , further comprising forming a liquid crystal layer between the first base substrate and the second base substrate.

Assignments (2)
CHANGE OF NAME Recorded Aug 28, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028863/0834 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2007
From: CHO, WOO-SIK; LEE, YUN-SEOK; WOO, DONG-WON; SON, JI-HYEON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 020213/0362 →