Techniques for connecting midplane connectors through a midplane
View Patent ↗A midplane has plated through holes (PTHs) which form a first profile and a second profile. The first profile has (i) an overlapping portion which overlaps at least part of the second profile and (ii) a non-overlapping portion which does not overlap any part of the second profile. A first connector mounts to a first side of the midplane over the first profile, and a second connector mounts to a second side of the midplane over the second profile. At least one PTH is a shared PTH which resides in both the first and second profiles and which engages a pin of the first connector and a pin of the second connector. Additionally, at least one PTH is a non-shared PTH which resides in the non-overlapping portion of the first profile and which engages a pin of the first connector without engaging any pins of the second connector.
1. A midplane assembly, comprising:
a midplane having dielectric material and a set of plated through holes supported by the dielectric material, the dielectric material substantially defining a first side and a second side of the midplane, the set of plated through holes being arranged within the dielectric to form a first profile of plated through holes and a second profile of plated through holes, the first profile of plated through holes having (i) an overlapping portion which overlaps at least part of the second profile of plated through holes and (ii) a non-overlapping portion which does not overlap any part of the second profile of plated through holes;
a first connector arranged to mount to the first side of the midplane over the first profile of plated through holes; and
a second connector arranged to mount to the second side of the midplane over the second profile formed by the set of plated through holes;
at least one plated through hole of the set of plated through holes being a shared plated through hole which resides in both the first and second profiles and which engages a pin of the first connector and a pin of the second connector; and
at least one plated through hole of the set of plated through holes being a non-shared plated through hole which resides in the non-overlapping portion of the first profile and which engages a pin of the first connector without engaging any pins of the second connector.
2. A midplane assembly as in claim 1 wherein a shape of the first profile of plated through holes mirrors a shape of a connecting side of the first connector; and
wherein a shape of the second profile of plated through holes mirrors a shape of a connecting side of the second connector.
3. A midplane assembly as in claim 2 wherein the each of the first and second profiles is substantially rectangular in shape.
4. A midplane assembly as in claim 3 wherein at least one plated through hole of the set of plated through holes is a non-shared plated through hole which resides in both the first and second profiles and which engages a pin of the first connector without engaging any pins of the second connector.
5. A midplane assembly as in claim 3 wherein at least one plated through hole of the set of plated through holes is a non-shared plated through hole which resides in both the first and second profiles and which engages a pin of the second connector without engaging any pins of the first connector.
6. A midplane assembly as in claim 3 wherein the second profile of plated through holes has (i) an overlapping portion which overlaps at least part of the first profile of plated through holes and (ii) a non-overlapping portion which does not overlap any part of the first profile of plated through holes; and
wherein at least one plated through hole of the set of plated through holes is a non-shared plated through hole which resides in the non-overlapping portion of the second profile and which engages a pin of the second connector without engaging any pins of the first connector.
7. A midplane assembly as in claim 3 wherein at least one plated through hole of the set of plated through holes is a non-shared plated through hole which resides in both the first and second profiles and which engages a pin of the first connector without engaging any pins of the second connector;
wherein at least one plated through hole of the set of plated through holes is a non-shared plated through hole which resides in both the first and second profiles and which engages a pin of the second connector without engaging any pins of the first connector;
wherein the second profile of plated through holes has (i) an overlapping portion which overlaps at least part of the first profile of plated through holes and (ii) a non-overlapping portion which does not overlap any part of the first profile of plated through holes; and
wherein at least one plated through hole of the set of plated through holes is a non-shared plated through hole which resides only in the second profile without residing in the first profile and which engages a pin of the second connector without engaging any pins of the first connector.
8. A midplane assembly as in claim 3 wherein the connecting side of the first connector and the connecting side of the second connector have a same pin layout.
9. A midplane assembly as in claim 3 wherein the connecting side of the first connector and the connecting side of the second connector have different pin layouts.
10. A midplane assembly as in claim 3 wherein the first connector and the second connector are high-density, substantially block-shaped, electrical circuit board connectors.
11. A midplane assembly as in claim 10 wherein each of the first and second connectors is arranged to carry differential mode signals.
12. A midplane assembly as in claim 11 wherein the connecting sides of the first and second connectors have arrays of differential pairs arranged in multiple rows and multiple columns, the multiple rows having a pitch that is different than that of the multiple columns.
13. A midplane assembly as in claim 12 wherein each differential pair has a first pin and a second pin which are offset at a 45 degree angle to the multiple rows and multiple columns.
14. An electronic system, comprising:
a first circuit board module;
a second circuit board module; and
a midplane assembly arranged to interconnect the first circuit board module with the second circuit board module, the midplane assembly including:
a midplane having dielectric material and a set of plated through holes supported by the dielectric material, the dielectric material substantially defining a first side and a second side of the midplane, the set of plated through holes being arranged within the dielectric to form a first profile of plated through holes and a second profile of plated through holes, the first profile of plated through holes having (i) an overlapping portion which overlaps at least part of the second profile of plated through holes and (ii) a non-overlapping portion which does not overlap any part of the second profile of plated through holes,
a first connector mounted to the first side of the midplane over the first profile of plated through holes and arranged to connect with the first circuit board module, and
a second connector mounted to the second side of the midplane over the second profile formed by the set of plated through holes and arranged to connect with the second circuit board module,
at least one plated through hole of the set of plated through holes being a shared plated through hole which resides in both the first and second profiles and which engages a pin of the first connector and a pin of the second connector, and
at least one plated through hole of the set of plated through holes being a non-shared plated through hole which resides in the non-overlapping portion of the first profile and which engages a pin of the first connector without engaging any pins of the second connector.
15. An electronic system as in claim 14 wherein a shape of the first profile of plated through holes mirrors a shape of a connecting side of the first connector; and
wherein a shape of the second profile of plated through holes mirrors a shape of a connecting side of the second connector.
16. An electronic system as in claim 15 wherein the each of the first and second profiles is substantially rectangular in shape.
17. An electronic system as in claim 16 wherein at least one plated through hole of the set of plated through holes is a non-shared plated through hole which resides in both the first and second profiles and which engages a pin of the first connector without engaging any pins of the second connector; and
wherein at least one plated through hole of the set of plated through holes is a non-shared plated through hole which resides in both the first and second profiles and which engages a pin of the second connector without engaging any pins of the first connector.
18. An electronic system as in claim 16 wherein the first connector and the second connector are high-density, substantially block-shaped, electrical circuit board connectors; and
wherein each of the first and second connectors is arranged to carry differential mode signals.
19. An electronic system as in claim 18 wherein the connecting sides of the first and second connectors have arrays of differential pairs arranged in multiple rows and multiple columns, the multiple rows having a pitch that is different than that of the multiple columns.
20. An electronic system as in claim 19 wherein each differential pair has a first pin and a second pin which are offset at a 45 degree angle to the multiple rows and multiple columns.
21. A midplane assembly as in claim 1 wherein the first connector includes a first connector pin arranged to insert through a first end of a shared plated through hole of the midplane, and wherein the second connector includes a second connector pin arranged to insert through a second end of the shared plated through hole, the second end of the being opposite the first end,
the shared plated through hole conveying a signal between the first connector pin of the first connector and the second connector pin of the second connector when the first connector pin is inserted through the first end of the shared plated through hole and concurrently the second connector pin is inserted through the second end of the shared plated through hole.
22. A midplane assembly as in claim 21 wherein the first connector pin of the first connector and the second connector pin of the second connector are physically and electrically separated from each other prior to insertion into the shared plated through hole of the midplane.
23. An electronic system as in claim 14 wherein the first connector includes a first connector pin arranged to insert through a first end of a shared plated through hole of the midplane, and wherein the second connector includes a second connector pin arranged to insert through a second end of the shared plated through hole, the second end of the being opposite the first end,
the shared plated through hole conveying a signal between the first connector pin of the first connector and the second connector pin of the second connector when the first connector pin is inserted through the first end of the shared plated through hole and concurrently the second connector pin is inserted through the second end of the shared plated through hole.
24. An electronic system as in claim 23 wherein the first connector pin of the first connector and the second connector pin of the second connector are physically and electrically separated from each other prior to insertion into the shared plated through hole of the midplane.
25. An electronic system as in claim 19 wherein at least one of the first module and the second module is configured to exchange a differential mode signal through a differential pair of the differential pairs arranged in the multiple rows and the multiple columns, the multiple rows having the pitch that is different than that of the multiple columns.