IP Library Granted Patent US 7,580,434
Granted Patent B2
US 7,580,434 · App. 11/863,098 · Granted Aug 25, 2009

Dual laser driver architecture in an optical transceiver

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Quick Facts
Patent No.
US 7,580,434
App. No.
11/863,098
Granted
Aug 25, 2009
Kind
B2
Abstract

Embodiments disclosed herein relate to a dual laser driver architecture configured to be implemented on a single IC chip. The dual laser driver architecture includes at least a first laser driver stage configured to drive a first laser with a first current and a second laser driver stage configured to drive a second laser with a second current that is less than the first current. Embodiments also relate to an optical transceiver that implements the dual laser driver architecture.

Claims (31)

1. A dual laser driver architecture configured to be implemented on a single IC chip comprising at least:

a first laser driver stage, the first laser driver stage being configured to drive a first laser with a first current; and

a second laser driver stage, the second laser stage being configured to drive a second laser with a second current that is less than the first current, wherein the first laser driver stage is an active match laser driver and the second laser driver stage is a CML laser driver.

2. The dual laser driver architecture in accordance with claim 1 , wherein the first laser is one of a DFB laser, FP laser, or VCSEL laser.

3. The dual laser driver architecture in accordance with claim 1 , wherein the second laser is a VCSEL.

4. The dual laser driver architecture in accordance with claim 1 , wherein the first current is approximately 80 mA and the second current is approximately 14 mA.

5. The dual laser driver architecture in accordance with claim 1 , wherein the first and second laser driver stages include or are coupled to a cross-point adjustment circuit and/or an independent rise/fall time control circuit.

6. The dual laser driver architecture in accordance with claim 1 , wherein the first and second laser driver stages are connected to a signal boost circuit configured to provide a boost to the signal output from the first and second laser driver stages.

7. A dual laser driver architecture configured to be implemented on a single IC chip comprising at least:

a first laser driver stage, the first laser driver stage being configured to drive a first laser with a first current; and

a second laser driver stage, the second laser stage being configured to drive a second laser with a second current that is less than the first current, wherein the first and second laser driver stages are connected to a post-amplifier through a multiplexer stage.

8. The dual laser driver architecture in accordance with claim 1 , wherein implementing the first and second laser driver stages on a single IC chip at least partially reduces EMI emissions.

9. The dual laser driver architecture in accordance with claim 1 , wherein a control module selects which one of the first and second laser driver stages are to be used.

10. An optical transceiver comprising:

a post-amplifier;

an optical receiver coupled to the post-amplifier;

a laser driver comprising at least:

a first laser driver stage, the first laser driver stage being configured to drive a first laser with a first current; and

a second laser driver stage, the second laser stage being configured to drive a second laser with a second current that is less than the first current;

a first electro-optical transducer coupled to the first driver stage;

a second electro-optical transducer coupled to the second driver stage; and

a control module coupled to the post-amplifier and the laser driver.

11. The optical transceiver in accordance with claim 10 , wherein the first electro-optical transducer is one of a DFB laser, FP laser, or VCSEL laser.

12. The optical transceiver in accordance with claim 10 , wherein the second electro-optical transducer is a VCSEL.

13. The optical transceiver in accordance with claim 10 , wherein the first current is approximately 80 mA and the second current is approximately 14 mA.

14. The optical transceiver in accordance with claim 11 , wherein the first laser driver stage is an active match laser driver and the second laser driver stage is a CML laser driver.

15. The optical transceiver in accordance with claim 10 , wherein the first and second laser driver stages include or are coupled to a cross-point adjustment circuit, and/or an independent rise/fall time control circuit, and/or a signal boost circuit configured to provide a boost to the signal output from the first and second laser driver stages.

16. The optical transceiver in accordance with claim 10 , wherein the post-amplifier and the laser driver are implanted on a single IC chip.

17. The optical transceiver in accordance with claim 16 , wherein the first and second laser driver stages are connected to the post-amplifier through a multiplexer stage.

18. The optical transceiver in accordance with claim 10 , wherein implementing the first and second laser driver stages on a single IC chip at least partially reduces EMI emissions.

19. The optical transceiver in accordance with claim 10 , wherein the control module selects which one of the first and second laser driver stages are to be used during operation of the optical transceiver.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2008
From: NGUYEN, THE'LINH
To: FINISAR CORPORATION
Reel/Frame 020452/0365 →