Proximity communication package for processor, cache and memory
A “sombrero” bridge transports signal communication between a processor and one or more cache memories. The bridge surrounds the processor's perimeter, and includes an aperture opposite the processor through which power and data can be provided to the processor from another device. The bridge exchanges signals with the cache memories via capacitively coupled proximity connections. The bridge communicates with the processor via conductive (e.g. wire) connections and optionally proximity connections. Spacing between opposing pads of the proximity connection(s) between the bridge and the cache memories can be provided by recesses in a surface of the cache memory, corresponding recesses in an opposing surface of the bridge, and a ball for each matching pair of corresponding cache memory and bridge recesses. The ball fits in and between the recesses of the matching pair. The recess depths and ball diameter(s) constrain a minimum distance between opposing pads of the proximity connection(s).
1. A system comprising:
a processor;
at least one cache memory;
a bridge that surrounds a perimeter of the processor, wherein the bridge enables signal communication between the at least one cache memory and the processor, and wherein a center portion of the bridge is open, forming an aperture through the bridge;
a power connection through the aperture to the processor;
at least one proximity connection between the bridge and at least one of the at least one cache memory or the processor, wherein the at least one proximity connection is arranged to carry the signal communication.
2. The system of claim 1 , comprising at least one proximity connection arranged to carry the signal communication between the processor and the bridge.
3. The system of claim 1 , wherein the at least one cache memory is located relative to the bridge via a plurality of recesses in a surface of the at least one cache memory, a plurality of corresponding recesses in an opposing surface of the bridge, and a ball for each matching pair of corresponding cache memory and bridge recesses wherein the ball is located between the cache memory recess and the corresponding bridge recess that form the matching pair.
4. The system of claim 3 , wherein the at least one proximity connection comprises at least one pad on the cache memory and at least one pad on the bridge, and wherein the balls and matching pairs of recesses constrain a minimum distance between the at least one pad on the cache memory and the at least one pad on the bridge.
5. The system of claim 3 , wherein the recesses are rectangular, and long axes of the cache memory recesses are orthogonal to long axes of the corresponding bridge recesses.
6. The system of claim 1 , wherein a compliance of the bridge mitigates topology variations in the system.
7. The system of claim 1 , comprising a second level package device and a data connection through the aperture between the processor and the second level package device.
8. The system of claim 1 , wherein the bridge comprises multiple apertures through the bridge and opposite the processor, each of the apertures forming a via that connects to the processor and is arranged to transport power or data signals.
9. The system of claim 1 , wherein the bridge has a thickness of less than 150 micrometers.
10. The system of claim 1 , wherein the bridge has a compliance ranging between 20 and 30 micrometers.
11. The system of claim 1 , wherein the processor is a microprocessor.
12. The system of claim 1 , comprising at least one electrically conductive connection between the bridge and at least one of the processor or the at least one cache memory, wherein the electrically conductive connection comprises electrically conductive material attached to the bridge.
13. The system of claim 12 , wherein the at least one electrically conductive connection connects the bridge to the processor.
14. The system of claim 12 , wherein the at least one electrically conductive connection connects the bridge to the at least one cache memory.
15. The system of claim 1 , wherein the bridge comprises a plurality of sub-bridges that are separately manufactured and then joined together to form the bridge.
16. The system of claim 1 , comprising at least one electrically conductive connection between the means for transmitting data and at least one of the processor or the at least one cache memory, wherein the electrically conductive connection comprises electrically conductive material attached to the means for transmitting data.
17. A system comprising:
a processor;
at least one cache memory; and
means for transmitting data between the processor and the at least one cache memory via at least one proximity connection, wherein the means for transmitting data surrounds the processor using a substrate, and wherein a center portion of the means for transmitting data is open, forming an aperture through the means for transmitting data.
18. The system of claim 17 , comprising at least one proximity connection arranged to carry the signal communication between the processor and the means for transmitting data.
19. The system of claim 17 , wherein the at least one cache memory is located relative to the means for transmitting data via:
a plurality of recesses in a surface of the at least one cache memory, a plurality of corresponding recesses in an opposing surface of the means for transmitting data, and a ball for each matching pair of corresponding cache memory and recesses in the means for transmitting data wherein the ball is located between the cache memory recess and the corresponding recess in the means for transmitting data that form the matching pair.
20. The system of claim 17 , wherein the means for transmitting data has a thickness of less than 150 micrometers and a compliance ranging between 20 and 30 micrometers.