IP Library Granted Patent US 8,075,112
Granted Patent B2
US 8,075,112 · App. 11/866,307 · Granted Dec 13, 2011

Printhead assembly with air cleaning arrangement

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Quick Facts
Patent No.
US 8,075,112
App. No.
11/866,307
Granted
Dec 13, 2011
Kind
B2
Abstract

A printhead assembly is provided for an inkjet printer. The printhead assembly includes an elongate ink distribution molding assembly. The ink distribution molding assembly defines longitudinal ink ducts and an air duct. A laminated ink distribution stack is mounted to the ink distribution molding assembly. The laminated ink distribution stack defines ink passages and at least one air passage in fluid communication with respective ones of the ink ducts and the air duct. A plurality of ink ejection integrated circuits (IC's) is mounted to the laminated ink distribution stack in fluid communication with the ink ducts to eject ink supplied from the ink ducts. A cover defines a plurality of apertures through which ink ejected from the IC's can pass. The cover is mounted to define a space between the IC's and the cover in which pressurized air can be provided from the air passage so that air can pass through the apertures to clean the apertures.

Claims (11)

1. A printhead assembly for an inkjet printer, the printhead assembly comprising:

an elongate ink distribution molding assembly defining longitudinal ink ducts and an air duct;

a laminated ink distribution stack mounted to the ink distribution molding assembly, the laminated ink distributions tack defining ink passages and at least one air passage in fluid communication with respective said ink ducts and said air duct;

a plurality of ink ejection integrated circuits (IC's) mounted to the laminated ink distribution stack in fluid communication with the ink ducts and configured to eject ink supplied from the ink ducts; and

a cover defining a plurality of apertures through which ink ejected from the IC's passes, the cover being mounted to define a space between the IC's and the cover in which space pressurised air is provided from said air passage through the apertures to clean the apertures, wherein

the ink distribution molding assembly includes an air valve molding defining a channel with a series of openings, the air valve molding being received within the air duct, and

the ink distribution molding assembly includes at least one compression spring maintaining a sealing inter-engagement of the air valve molding with the lamination stack to prevent air leakage when the air supply is closed.

2. A printhead assembly as claimed in claim 1 , wherein said at least one air passage includes a plurality of air passages and the spacing of the openings corresponds to that of the air passages.

3. A printhead assembly as claimed in claim 1 , wherein the IC's are mounted to the laminated ink distribution stack with a printing overlap between adjacent IC's to enable continuous transmission of ink over the collective length of the IC's.

4. A printhead assembly as claimed in claim 1 , wherein each IC is electronically connected to one end of a tape automated bond (TAB) film, the other end of which is maintained in electrical contact with a printed circuit board by means of a TAB film backing pad.

5. A printhead assembly as claimed in claim 2 , wherein the air valve molding is movable longitudinally within the air duct to bring the openings into alignment with corresponding air passages and allow supply of the pressurized air through the laminated stack, and to move the openings out of alignment to close off the air supply.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028530/0947 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2007
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 019909/0870 →