Memory cell and process for manufacturing the same
View Patent ↗A memory cell and a process for manufacturing the same are provided. In the process, a first electrode layer is formed on a conductive layer over a substrate, and then a transition metal layer is formed on the first electrode layer. After that, the transition metal layer is subjected to a plasma oxidation step to form a transition metal oxide layer as a precursor of a data storage layer, and a second electrode layer is formed on the transition metal oxide layer. A memory cell is formed after the second electrode layer, the transition metal oxide layer and the first electrode layer are patterned into a second electrode, a data storage layer and a first electrode, respectively.
1. A process for manufacturing a memory cell, comprising:
forming a first electrode layer on a conductive layer;
forming a transition metal layer on the first electrode layer;
performing a plasma oxidation step to the transition metal layer to form a transition metal oxide layer as a precursor of a data storage layer; and
forming a second electrode layer on the transition metal oxide layer.
2. The process of claim 1 , further comprising:
patterning the second electrode layer, the transition metal oxide layer and the first electrode layer into a second electrode, the data storage layer and a first electrode, respectively; and
forming a dielectric layer over the conductive layer covering sidewalls of the first electrode, the data storage layer and the second electrode.
3. The process of claim 2 , wherein the step of forming the dielectric layer comprises:
depositing a dielectric material over the conductive layer covering the first electrode, the data storage layer and the second electrode; and
planarizing the dielectric material and a top surface of the second electrode, the planarized dielectric material being the dielectric layer.
4. The process of claim 2 , further comprising forming a bit line on the dielectric layer and the second electrode after the dielectric layer is formed.
5. The process of claim 1 , wherein the transition metal layer comprises titanium, Cu, PrCaMn, Ni or W.
6. The process of claim 1 , wherein the transition metal oxide layer comprises titanium oxide, copper oxide, PrCaMnO (PCMO), nickel oxide or tungsten oxide.
7. The process of claim 1 , wherein the transition metal layer is formed on the first electrode layer by chemical vapor deposition or physical vapor deposition.
8. The process of claim 1 , wherein the conductive layer serves as a conductive wire of the memory cell.
9. The process of claim 1 , wherein a pressure set in the plasma oxidation step ranges from 1 mTorr to 10,000 mTorr.
10. The process of claim 9 , wherein the pressure set in the plasma oxidation step is about 3,000 mTorr.
11. The process of claim 1 , wherein in the plasma oxidation step, oxygen gas is supplied in a flow rate of 10 sccm to 10,000 sccm.
12. The process of claim 11 , wherein the oxygen gas is supplied in a flow rate of about 4,000 sccm.
13. The process of claim 1 , wherein the plasma oxidation step is a down-stream (remote) plasma oxidation step.
14. The process of claim 1 , wherein the data storage layer maintains a resistivity difference between different states of the memory cell within a retention time.
15. The process of claim 14 , wherein the retention time is approximately 1,000 seconds at least.
16. A memory cell, comprising:
a first electrode disposed on a conductive layer;
a transition metal oxide layer as a data storage layer disposed on the first electrode, being formed through plasma oxidation of a transition metal layer; and
a second electrode disposed on the data storage layer.
17. The memory cell of claim 16 , further comprising:
a dielectric layer disposed over the conductive layer covering sidewalls of the first electrode, the transition metal oxide layer and the second electrode, wherein a top surface of the dielectric layer and a top surface of the second electrode are coplanar.
18. The memory cell of claim 17 , further comprising:
a bit line disposed on the second electrode and the dielectric layer.
19. The memory cell of claim 18 , wherein the dielectric layer is an inter-metal dielectric (IMD) layer.
20. The memory cell of claim 17 , wherein the dielectric layer comprises silicon oxide.
21. The memory cell of claim 16 , wherein the transition metal oxide layer comprises titanium oxide, copper oxide, PrCaMnO (PCMO), nickel oxide or tungsten oxide.
22. The memory cell of claim 16 , wherein the conductive layer serves as a conductive wire of the memory cell.
23. The memory cell of claim 16 , which is a memory cell of a non-volatile random-access memory (NVRAM).
24. The memory cell of 16 , wherein the data storage layer maintains a resistivity difference between different states of the memory cell within a retention time.
25. The memory cell of claim 24 , wherein the retention time is approximately 1,000 seconds at least.