Apparatus and method for connecting an array of cables to a circuit board
View Patent ↗The present invention provides an apparatus and method for connecting an array of cables (e.g., coaxial cables) to a circuit board (e.g., the surface of the circuit board).
1. A connector apparatus for connecting a plurality of cables to a circuit board, comprising:
a frame;
a plurality of holes in the frame, each hole extending from a first surface of the frame to a second surface of the frame, which second surface faces in a direction opposite of the direction in which the first surface faces, and each hole being configured to house an end portion of one of the plurality of cables, wherein the plurality of holes forms a plurality of rows of holes, wherein, for each of the rows, all holes in the row are arranged in a straight line;
a plurality of rows of raised ground pads on the second surface of the frame, each raised ground pad having a mating face and projecting outwardly from the second surface, wherein (a) the mating faces of the ground pads are coplanar, (b) for each row of ground pads, the plurality of ground pads in the row are arranged in a straight line, and (c) at least a portion of each row of holes is positioned between one of the ground pad rows and another of the ground pad rows; and
a plurality of contacts, each being configured to fit into one of the holes and to receive an end of an inner conductor of one of the cables;
wherein said each raised ground pad is a solid, substantially cylindrical contact element.
2. The connecter apparatus of claim 1 , wherein the cables are coaxial cables.
3. The connecter apparatus of claim 1 , wherein the diameters of the contacts and the holes are sized to produce a system impedance of 50 ohms.
4. The connector apparatus of claim 1 , wherein
each of the plurality of contacts has a mating face for contacting a signal pad, and
each of the plurality of contacts is positioned in one of said holes such that, for each said contact, the mating face of the contact is coplanar with the mating faces of the ground pads.
5. The connector apparatus of claim 1 , wherein
each of the plurality of contacts has a mating face for contacting a signal pad, and
each of the plurality of contacts is positioned in one of said holes such that, for each said contact, the mating face of the contact extends beyond the second surface of the frame.
6. An apparatus comprising:
a frame having a hole extending from a first surface of the frame to a second surface of the frame;
a cable comprising a signal conductor and an outer conductor surrounding the signal conductor, a tip of the signal conductor being located within the hole of the frame and the outer conductor being electrically connected to the frame;
a printed circuit board comprising an array of signal pads and a ground plane;
a plurality of rows of raised ground pads on the second surface of the frame and electrically connecting the frame to the ground plane of the printed circuit board; and
a contact at least partially within the hole and electrically connecting the signal conductor of the cable to one of the signal pads, wherein
the contact is connected to a signal pad with a first type of adhesive, the contact is connected to the signal conductor with a second type of adhesive, and the outer conductor is connected to the frame with a third type of adhesive.
7. The apparatus of claim 6 , wherein the first type of adhesive has a first melting point, the second type of adhesive has a second melting point that is higher than the first melting point, and the third type of adhesive has a melting point between the first melting point and the second melting point.
8. The apparatus of claim 6 , wherein the cable is a coaxial cable.
9. The apparatus of claim 6 , wherein a diameter of the contact and a diameter of the hole are sized to produce an impedance of 50 ohms.
10. The apparatus of claim 6 , wherein the first type of adhesive is a first type of solder, the second type of adhesive is a second type of solder, and the third type of adhesive is a third type of solder.
11. The apparatus of claim 10 , wherein the first type of solder has a first melting point, the second type of solder has a second melting point that is higher than the first melting point, and the third type of solder has a melting point between the first melting point and the second melting point.
12. The apparatus of claim 6 , wherein the first type of adhesive, the second type of adhesive, and/or the third type of adhesive comprises a silver filled two part epoxy.