IP Library Granted Patent US 7,468,140
Granted Patent B2
US 7,468,140 · App. 11/868,531 · Granted Dec 23, 2008

Method of protecting nozzle guarded printhead during fabrication

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Quick Facts
Patent No.
US 7,468,140
App. No.
11/868,531
Granted
Dec 23, 2008
Kind
B2
Abstract

A method of fabricating a printhead is provided in which sacrificial material is deposited on a substrate having printing nozzles formed thereon so that a first portion of the sacrificial material encases the nozzles and a second portion of the sacrificial material forms part of a printing fluid containment formation surrounding one or more of the nozzles, positioning a nozzle guard over the nozzles so as to contact the second portion of the sacrificial material, and removing the first portion of the sacrificial material.

Claims (9)

1. A method of fabricating a printhead comprising the steps of:

depositing sacrificial material on a substrate having printing nozzles formed thereon so that a first portion of the sacrificial material encases the nozzles and a second portion of the sacrificial material forms part of a printing fluid containment formation surrounding one or more of the nozzles;

positioning a nozzle guard over the nozzles so as to contact the second portion of the sacrificial material; and

removing the first portion of the sacrificial material.

2. A method as claimed in claim 1 , wherein the sacrificial material is a polyimide.

3. A method as claimed in claim 2 , wherein the positioning step includes contacting the nozzle guard and the second portion of the polyimide sacrificial material via an inorganic seal.

4. A method as claimed in claim 1 , wherein the positioning step includes positioning support struts of the nozzle guard on alignment formations extending from the substrate formed by the second portion of the sacrificial material, the alignment formations being configured to align apertures in the nozzle guard with the nozzles.

5. A method as claimed in claim 4 , wherein the removing step includes carrying out a plasma etching process through the apertures of the nozzle guard.

6. A method as claimed in claim 5 , wherein the plasma etching process is an oxygen plasma etch.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028569/0911 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2007
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 019927/0931 →