IP Library Granted Patent US 8,048,521
Granted Patent B2
US 8,048,521 · App. 11/871,459 · Granted Nov 1, 2011

Multilayer heat sealant structures, packages and methods of making the same

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Quick Facts
Patent No.
US 8,048,521
App. No.
11/871,459
Granted
Nov 1, 2011
Kind
B2
Abstract

The embodiments of the present invention relate to multilayer thermoplastic structures having improved sealability and tearability. More specifically, the present invention relates to a multilayer heat sealant structure having at least three layers that may be coextrusion coated or otherwise laminated to a substrate, such as metallized polymeric material, foil, or other substrates.

Claims (12)

1. A multilayer structure comprising first and second multilayer heat sealant structures, each of the first and second multilayer structures comprising:

a coextruded multilayer heat sealant structure comprising a low melt index layer comprising low density polyethylene and a high melt index layer comprising a single site catalyzed polyethylene wherein said single site catalyzed polyethylene has a melt index above about 10 g/10 min for use as a heat sealant layer wherein the high melt index layer is disposed adjacent to the low melt index layer, and further wherein the high melt index layer is coextruded with the low melt index layer and further wherein said low density polyethylene of the low melt index layer has a melt index lower than a melt index of the single site catalyzed polyethylene of the high melt index layer; and

wherein at least a portion of the first multilayer heat sealant structure is sealed to at least a portion of the second multilayer heat sealant structure such that the high melt index layers of the first and second multilayer heat sealant structures abut each other.

2. The multilayer structure of claim 1 wherein each of the first and second multilayer heat sealant structures comprise at least one edge, and wherein the at least one edges of the first and second multilayer heat sealant structures are heat sealed.

3. The multilayer structure of claim 1 wherein the low melt index layer comprises a blend of low density polyethylene and high density polyethylene.

4. The multilayer structure of claim 1 wherein the high melt index layer comprises metallocene-based single site catalyzed polyethylene.

5. The multilayer structure of claim 1 wherein the high melt index layer comprises a blend of the single site catalyzed polyethylene and low density polyethylene.

6. The multilayer structure of claim 1 wherein the single site catalyzed polyethylene has a density of about 0.912 g/cc and a melt index of about 12 g/10 min at 190° C.

7. The multilayer structure of claim 1 wherein the single site catalyzed polyethylene has a density of about 0.910 g/cc and a melt index of about 15 g/10 min. at 190° C.

8. The multilayer structure of claim 1 wherein the at least a portion of the first multilayer structure is heat sealed to the at least a portion of the second multilayer structure.

9. The multilayer structure of claim 1 wherein each of the first and second multilayer heat sealant structures further comprise a first layer comprising a thermoplastic polymeric material, wherein said low melt index layer is disposed adjacent to and coextruded with the first layer.

10. The multilayer structure of claim 9 wherein said thermoplastic polymeric material of the first layer comprises ethylene acrylic acid copolymer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2013
From: SCHAEFER, SUZANNE E.; BLEMBERG, ROBERT J.; GENSKE, ROGER P.
To: PECHINEY EMBALLAGE FLEXIBLE EUROPE
Reel/Frame 030892/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2010
From: ALCAN PACKAGING FLEXIBLE FRANCE
To: BEMIS COMPANY, INC.
Reel/Frame 024380/0968 →