IP Library Granted Patent US 8,240,217
Granted Patent B2
US 8,240,217 · App. 11/872,596 · Granted Aug 14, 2012

Diaphragm isolation forming through subtractive etching

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,240,217
App. No.
11/872,596
Granted
Aug 14, 2012
Kind
B2
Abstract

Described herein is a housing comprising an inside and at least one sidewall, wherein the at least one sidewall comprises inner and outer surfaces. An etch stop deposit is disposed over at least a portion of the housing, and a diaphragm material deposit is disposed over at least a portion of the etch stop deposit.

Claims (39)

1. A housing comprising:

at least one sidewall, wherein the sidewall comprises inner and outer surfaces, the inner surface defining a portion of a boundary of an inside of the housing,

an etch stop deposit disposed over at least a portion of the housing, and

a diaphragm material deposit disposed over at least a portion of the etch stop deposit,

wherein the at least a portion of the housing defines an etching such that at least part of the etch stop deposit is exposed to one of an outside of the housing or the inside of the housing through the etching.

2. The housing of claim 1 , further comprising a protective deposit disposed over at least a portion of the diaphragm material deposit.

3. The housing of claim 1 , wherein the part of the at least a portion of the housing has been removed, thereby exposing the etch stop deposit to the inside.

4. The housing of claim 3 , wherein at least a portion of the sidewall has been removed.

5. The housing of claim 3 , further comprising at least one end, wherein at least a portion of the end has been removed.

6. The housing of claim 1 , wherein the part of the at least a portion of the housing has been removed, thereby exposing the etch stop deposit to an exterior of the housing.

7. The housing of claim 6 , wherein at least a portion of the sidewall has been removed.

8. The housing of claim 6 , further comprising at least one end, wherein at least a portion of the end has been removed.

9. The housing of claim 1 , wherein the housing has a substantially round cross-section.

10. The housing of claim 1 , wherein the housing is an implantable medical device.

11. A structure comprising:

front and back surfaces,

a plurality of etch stop deposits disposed over at least a portion of the front surface, and

a plurality of diaphragm material deposits each disposed over at least a portion of one of the etch stop deposits,

wherein the structure defines etchings from the back surface to the front surface of the structure such that at least a part of each of the plurality of etch stop deposits is exposed from the back surface through the etchings.

12. A method of isolating a diaphragm on a housing, the method comprising:

depositing an etch stop deposit on at least a portion of the housing,

depositing a diaphragm material deposit on at least a portion of the etch stop deposit, and

removing at least a part of the at least the portion of the housing over which the etch stop deposit is deposited to expose the etch stop deposit to either an inside or an outside of the housing.

13. The method of claim 12 , further comprising etching at least a portion of an inner surface of the housing, thereby exposing at least a portion of the etch stop deposit to the inside of the housing.

14. The method of claim 12 , further comprising etching at least a portion of an outer surface of the housing, thereby exposing at least a portion of the etch stop deposit to the exterior of the housing.

15. The method of claim 12 , wherein depositing the etch stop deposit comprises electroplating the etch stop deposit onto the housing.

16. The method of claim 12 , wherein depositing the diaphragm material deposit comprises electroplating the diaphragm material deposit on at least a portion of the etch stop deposit.

17. The method of claim 12 , further comprising depositing a protective deposit on at least a portion of the diaphragm material deposit.

18. The method of claim 12 , wherein the housing is a sensor.

19. A plate comprising:

front and back surfaces,

an etch stop deposit disposed on at least a portion of the front surface, and

a diaphragm material deposit disposed over at least a portion of the etch stop deposit,

wherein the plate defines an etching from the back surface to the front surface of the plate such that at least part of the etch stop deposit is exposed from the back surface through the etching.

20. The plate of claim 19 , further comprising a mask disposed over at least a portion of the back surface.

21. A method of forming a plurality of plates, the method comprising:

providing the structure of claim 11 ; and

cutting the structure to provide a plurality of plates.

22. The housing of claim 1 , wherein the etch stop deposit is selected from the group consisting of gold, platinum, or rhodium.

Assignments (4)
SECURITY INTEREST Recorded Feb 25, 2016
From: BEI NORTH AMERICA LLC; CRYDOM, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC.; KAVLICO CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037927/0605 →
RELEASE OF SECURITY INTEREST Recorded Dec 2, 2015
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: BEI SENSORS & SYSTEMS COMPANY, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC.; CRYDOM, INC.; BEI TECHNOLOGIES, INC.; KAVLICO CORPORATION
Reel/Frame 037196/0174 →
SECURITY AGREEMENT Recorded Oct 3, 2014
From: BEI SENSORS & SYSTEMS COMPANY, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC; CRYDOM, INC.; BEI TECHNOLOGIES, INC.; KAVLICO CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 033888/0700 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2007
From: GUZIAK, ROBERT; GANDARIA, ENRIQUE
To: KAVLICO CORPORATION
Reel/Frame 019964/0059 →