Printhead assembly with integrated circuit optimised for adhesive bonding
A printhead assembly includes a printhead integrated circuit (IC) having a plurality of micro-electromechanical nozzle arrangements for operatively ejecting printing fluid onto a printing medium. A plurality of discrete supply channels supplies the nozzle arrangements with fluid and a bonding surface has a plurality of apertures etched therein. The apertures are shaped and dimensioned to operatively attract a liquid adhesive by capillary action. The assembly also includes an upper member and a lower member operatively joined to define a plurality of discrete fluid conduits, and a sealing film to adhere the bonding surface of the IC to the lower member, so that the conduits and supply channels are in fluid communication with each other.
1. A printhead assembly comprising:
a printhead integrated circuit (IC) having a plurality of micro-electromechanical nozzle arrangements for operatively ejecting printing fluid onto a printing medium, a plurality of discrete supply channels for supplying the nozzle arrangements with fluid and a bonding surface having a plurality of apertures etched therein, the apertures being shaped and dimensioned operatively to attract a liquid adhesive by capillary action;
an upper member and a lower member operatively joined to define a plurality of discrete fluid conduits; and
a sealing film to adhere the bonding surface of the IC to the lower member, so that the conduits and supply channels are in fluid communication with each other.
2. The printhead assembly of claim 1 , wherein a width of the etched apertures is less than 10 microns.
3. The printhead assembly of claim 1 , wherein a depth of the etched apertures is at least 20 microns.
4. The printhead assembly of claim 1 , wherein a depth-to-width aspect ratio of the etched apertures is at least 3:1.
5. The printhead assembly of claim 1 , wherein the upper and lower members are injection moulded and are of a liquid crystal polymer (LCP).
6. The printhead assembly of claim 1 , wherein the sealing film is a thermoplastic film.
7. The printhead assembly of claim 1 , wherein the sealing film is a thermosetting film.