Semiconductor devices and methods of fabricating the same
In a method of fabricating a semiconductor device, a first mask pattern is formed on a substrate. The first mask pattern has a first opening formed to expose the substrate. An oxidation barrier region is formed in the substrate exposed by the first opening, and the first mask pattern is patterned to form a second mask pattern having a second opening. A gate insulation layer is formed on the substrate exposed by the second opening. The gate insulation layer has a variable thickness.
1. A method of fabricating a semiconductor device, the method comprising:
forming a first mask pattern on a substrate, the first mask pattern having a first opening exposing a first portion of the substrate, the first opening being T-shaped, wherein
the first mask pattern includes a lower mask layer pattern and an upper mask layer pattern,
the lower mask layer pattern exposes the first portion of the substrate, and
the upper mask layer pattern exposes a portion of the lower mask layer pattern;
forming an oxidation barrier region in the exposed first portion of the substrate;
patterning the first mask pattern to form a second mask pattern having a second opening, the second opening exposing a second portion of the substrate, the second opening being I-shaped, wherein
a width of the lower mask layer pattern is the same width as the upper mask layer pattern; and
forming a gate insulation layer on the exposed second portion of the substrate, the gate insulation layer having a variable thickness, wherein
a width of the second opening substantially has the same width as an upper part of the first opening, and
the width of the second opening is wider than a width of a lower part of the first opening.
2. The method as set forth in claim 1 , wherein the gate insulation layer has a larger thickness at an edge portion than at the oxidation barrier region.
3. The method as set forth in claim 1 , wherein the forming the first mask pattern includes:
forming a lower mask layer on the substrate;
forming an upper mask layer on the lower mask layer;
etching the upper mask layer and the lower mask layer to form the upper mask layer pattern and the lower mask layer pattern, the upper mask layer pattern and the lower mask layer pattern exposing the first portion of the substrate; and
partially etching the upper mask layer pattern to expose the portion of the lower mask layer pattern.
4. The method as set forth in claim 3 , wherein the upper mask layer has a higher etch selectivity than the lower mask layer.
5. The method as set forth in claim 3 , wherein the upper mask layer includes silicon nitride.
6. The method as set forth in claim 3 , wherein the lower mask layer includes silicon oxide.
7. The method as set forth in claim 3 , wherein the forming the second mask pattern includes;
removing the exposed portion of the lower mask layer pattern.
8. The method as set forth in claim 1 , wherein the oxidation barrier region is formed using a nitrogen ion implanting process.
9. The method as set forth in claim 1 , further including,
forming a spacer on an inner sidewall of the second opening.
10. The method as set forth in claim 9 , wherein the spacer includes silicon nitride.
11. The method as set forth in claim 1 , wherein the gate insulation layer is formed using a thermal oxidation process.
12. The method as set forth in claim 9 , further including,
forming a gate conductive layer to fill the second opening,
planarizing the gate conductive layer to form a gate electrode, and
removing the second mask pattern and the spacer.
13. The method as set forth in claim 12 , wherein the gate conductive layer is planarized using a polishing process using the second mask pattern as a polish-stop layer.
14. The method as set forth in claim 13 , wherein the polishing process includes a chemical mechanical polishing process.
15. The method as set forth in claim 12 , wherein the gate conductive layer includes polysilicon.
16. The method as set forth in claim 12 , further including,
forming an offset spacer on opposite sidewalls of the gate insulation layer and the gate electrode,
forming an extension region adjacent to the offset spacer in the substrate,
forming an insulating spacer on a sidewall of the offset spacer, and
forming a source/drain region adjacent to the insulating spacer in the substrate, the source/drain region at least partially overlapping the extension region.
17. The method as set forth in claim 16 , wherein the offset spacer includes at least one of a thermal oxide and a low temperature oxide.
18. The method as set forth in claim 16 , wherein the offset spacer is arranged in a stack structure including the thermal oxide and the low temperature oxide which are stacked in the order name.
19. The method as set forth in claim 1 , wherein the patterning of the first mask pattern to form the second mask pattern having the second opening exposing the second portion of the substrate includes,
etching a sidewall of the first mask pattern to form the second opening, the second opening being larger than the oxidation barrier region, and
forming a spacer on an inner sidewall of the second opening.
20. The method as set forth in claim 19 , wherein the spacer includes silicon nitride.
21. The method as set forth in claim 19 , further including,
forming a gate conductive layer to fill the second opening,
planarizing the gate conductive layer to form a gate electrode,
removing the second mask pattern and the spacer,
forming an offset spacer on opposite sidewalls of the gate insulation layer and the gate electrode,
forming an extension region adjacent to the offset spacer in the substrate,
forming an insulating spacer on a sidewall of the offset spacer, and
forming a source/drain region adjacent to the insulating spacer in the substrate, the source/drain region at least partially overlapping the extension region.
22. The method of claim 21 , wherein the planarizing gate conductive layer is planarized using a polishing process using the mask pattern as a polish-stop layer.