Modular high-density computer system
View Patent ↗A modular high-density computer system has an infrastructure that includes a framework component forming a plurality of bays and has one or more cooling components. The computer system also has one or more computational components that include a rack assembly and a plurality of servers installed in the rack assembly. Each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the site.
1. A modular high-density computer system comprising:
an infrastructure comprising:
a framework component forming a plurality of bays;
one or more cooling components;
one or more computational components comprising:
a rack assembly; and
a plurality of servers installed in the rack assembly; wherein the infrastructure further comprises a data I/O distribution component and a connector coupled thereto; and the rack assembly further comprises a data I/O distribution strip coupled to the plurality of servers; and a connector coupled to the data I/O distribution strip for coupling with the connector of the data I/O distribution component when installed in one of the plurality of bays; and
wherein each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the installation site.
2. The modular high-density computer system of claim 1 wherein:
the infrastructure further comprises a power distribution component and a connector coupled thereto; and
the rack assembly further comprises a power distribution strip coupled to the plurality of servers; and
a connector coupled to the power distribution strip for coupling with the connector of the power distribution component when installed in one of the plurality of bays.
3. The modular high-density computer system of claim 1 wherein at least one of the cooling components is a heat exchange cooling system housed within one of the plurality of bays.
4. A modular high-density computer system comprising:
an infrastructure comprising:
a framework component forming a plurality of bays;
a power distribution component and a connector coupled thereto;
a data I/O distribution component and a connector coupled thereto; and
one or more cooling components; and
one or more rack assemblies comprising:
a power distribution strip for providing power to a plurality of servers when said servers are installed in said one or more rack assemblies; and a connector coupled to the power distribution strip for coupling with the connector of the power distribution component when said one or more rack assemblies is installed in said plurality of bays; and
a data I/O distribution strip for coupling data I/O to a plurality of servers when said servers are installed in said one or more rack assemblies; and a connector coupled to the data I/O distribution strip for coupling with the connector of the data I/O distribution component when said one or more rack assemblies is installed in said plurality of bays; and
wherein each of the one or more rack assemblies is shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the installation site.
5. The modular high-density computer system of claim 4 further comprising one or more computational components, each of the one or more computational components comprising one of the plurality of rack assemblies and a plurality of servers installed therein.
6. The modular high-density computer system of claim 5 wherein the one or more computational components are tested to be fully operational prior to shipment and installation within one of the plurality of bays.
7. The modular high-density computer system of claim 4 wherein at least one of the cooling components is a heat exchange cooling system housed within one of the plurality of bays.
8. A method of manufacturing a high-density computer system comprising:
assembling an infrastructure comprising:
a framework component forming a plurality of bays;
one or more cooling components;
assembling one or more computational components, said assembling further comprising installing a plurality of servers in a rack assembly;
shipping the infrastructure to an installation site separately from and ahead of the one or more computational components;
installing the infrastructure at the installation site;
shipping the one or more computational components to the installation site; and
installing each of the one or more computational components in one of the plurality of bays after the infrastructure is installed at the installation site.
9. The method of manufacturing a high-density computer system of claim 8 wherein said installing the infrastructure further comprises installing a heat exchange cooling system within one or more of the plurality of bays.
10. The method of manufacturing a high-density computer system of claim 8 wherein:
the assembled infrastructure further comprises a power distribution component and a connector coupled thereto; and
the rack assembly of the assembled computational components further comprises a power distribution strip coupled to the plurality of servers; and a connector coupled to the power distribution strip for coupling with the connector of the power distribution component when installed in one of the plurality of bays.
11. The method of manufacturing a high-density computer system of claim 8 wherein:
the assembled infrastructure further comprises a data I/O distribution component and a connector coupled thereto; and
the rack assembly of the assembled computational components further comprises a data I/O distribution strip coupled to the plurality of servers; and a connector coupled to the data I/O distribution strip for coupling with the connector of the data I/O distribution component when installed in one of the plurality of bays.
12. The method of manufacturing a high-density computer system of claim 8 wherein said assembling one or more computational components further comprises testing the one or more computational components to be fully operational prior to said shipping and said installing of the computational components.
13. The method of manufacturing a high-density computer system of claim 10 wherein said installing each of the one or more computational components in one of the plurality of bays further comprises coupling the connector of the power distribution strip to the connector of the power distribution component.
14. The method of manufacturing a high-density computer system of claim 11 wherein said installing each of the one or more computational components in one of the plurality of bays further comprises coupling the connector of the data I/O distribution strip to the connector of the data I/O component.