IP Library Granted Patent US 7,857,028
Granted Patent B2
US 7,857,028 · App. 11/882,049 · Granted Dec 28, 2010

Mounting device for electrical component

Assignees: Sony Corporation; Sony Chemical & Information Device Corp.
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Quick Facts
Patent No.
US 7,857,028
App. No.
11/882,049
Granted
Dec 28, 2010
Kind
B2
Abstract

A mounting device for an electric component includes a thermocompression bonding head with a pressure bonding member made of a predetermined elastomer, the pressure bonding member provided in a head main body, and a pressing force adjusting mechanism for adjusting a pressing force corresponding to a region on a pressure bonding surface of the pressure bonding member, wherein the pressure bonding member is pressed at a predetermined pressure toward an electric component placed on a wiring board.

Claims (14)

1. A mounting device for an electric component, comprising:

a thermocompression bonding head including a pressure bonding member made of a predetermined elastomer and the pressure bonding member is provided in a head main body, and

a pressing force adjusting mechanism for adjusting a pressing force corresponding to a region on a pressure bonding surface of the pressure bonding member, the pressing force adjusting mechanism having a frame-shaped pressing force adjusting portion provided on the edges of the head main body, the pressure bonding member being provided in a concave portion inside the frame-shaped pressing force adjusting portion and having a cut portion ,provided on the surface thereof as the pressing force adjusting mechanism,

wherein the pressure bonding member is pressed at a predetermined pressure toward an electric component placed on a wiring board.

2. A mounting device for an electric component, comprising:

a thermocompression bonding head including a pressure bonding member made of a predetermined elastomer and the pressure bonding member is provided in a head main body, and

a pressing force adjusting mechanism for adjusting a pressing force corresponding to a region on a pressure bonding surface of the pressure bonding member, the pressing force adjusting mechanism having a frame-shaped pressing force adjusting portion provided on the edges of the head main body, and having the pressure bonding member provided in a concave portion inside the frame-shaped pressing force adjusting portion, the pressure bonding member being configured by combining a plurality of the pressure bonding members in an integral manner, the pressure bonding member comprising a plurality of integrally-bonded elastomeric members having a plurality of hardness values,

wherein the pressure bonding member is pressed at a predetermined pressure toward an electric component placed on a wiring board.

3. A mounting device for an electric component, comprising:

a thermocompression bonding head including a pressure bonding member made of a predetermined elastomer and the pressure bonding member is provided in a head main body, and

a pressing force adjusting mechanism for adjusting a pressing force corresponding to a region on a pressure bonding surface of the pressure bonding member, the pressing force adjusting mechanism comprising:

a frame-shaped pressing force adjusting portion provided on the edges of the head main body, the pressure bonding member being provided in a concave portion inside the frame-shaped pressing force adjusting portion, and

a cut portion formed on the pressure bonding surface, the cut portion acting to adjust pressing force,

wherein the pressure bonding member is pressed at a predetermined pressure toward an electric component placed on a wiring board.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2010
From: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
To: SONY CORPORATION
Reel/Frame 025230/0854 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2007
From: KANISAWA, SHIYUKI
To: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Reel/Frame 020048/0669 →
Priority Claims (1)
JP 2005-026787 · Feb 2, 2005 · national
Continuity (2)
Continuation PCTJP200630120200 · Jan 26, 2006
Related Publication 20080035274A1 · Feb 14, 2008