IP Library Granted Patent US 7,833,807
Granted Patent B2
US 7,833,807 · App. 11/882,595 · Granted Nov 16, 2010

Method of manufacturing semiconductor laser for communication, semiconductor laser for communication and optical transmission module

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Quick Facts
Patent No.
US 7,833,807
App. No.
11/882,595
Granted
Nov 16, 2010
Kind
B2
Abstract

Some semiconductor lasers have an initial failure mode that is advanced as the amount of optical power therein, namely, the amount of optical output observed from the outside increases in almost independent of the temperature. The initial failure mode that is advanced as the amount of optical output increases is not sufficiently screened, so that the initial failure rate is somewhat higher than that of the semiconductor laser having the conventional active layer material. It is effective to introduce a test with large optical output at lower temperature than average operating temperature such as room temperature, during the manufacturing process. This helps to eliminate elements having the initial failure mode that is advanced as the amount optical output increases, thereby to extend the expected life of the laser diodes.

Claims (8)

1. A method of manufacturing a semiconductor laser for communication including a screening step of constant operating current with an optical output of not less than 15 mW at the initial optical output, or of constant optical output with an optical output of not less than 15 mW.

2. The method of manufacturing a semiconductor laser for communication according to claim 1 , characterized in that said method includes a screening step of constant operating current with an optical output of not less than 20 mW at the initial optical output, or of constant optical output with an optical output of not less than 20 mW.

3. The method of manufacturing a semiconductor laser for communication according to claim 2 , characterized in that a material whose reliability is more easily affected by crystal defects than the case of using InGaAsP, is applied as an active layer of the semiconductor laser.

4. The method of manufacturing a semiconductor laser for communication according to claim 1 , characterized in that a material whose reliability is more easily affected by crystal defects than the case of using InGaAsP, is applied as an active layer of the semiconductor laser.

5. A method of manufacturing a semiconductor laser for communication including a screening step of constant operating current with an optical output of not less than 50% of the saturation optical output at the initial optical output, or of constant optical output with an optical output of not less than 50% of the saturation optical output.

6. The method of manufacturing a semiconductor laser for communication according to claim 5 , characterized in that said semiconductor laser for communication is a surface emitting laser.

7. The method of manufacturing a semiconductor laser for communication according to claim 6 , characterized in that a material whose reliability is more easily affected by crystal defects than the case of using InGaAsP, is applied as an active layer of the semiconductor laser.

8. The method of manufacturing a semiconductor laser for communication according to claim 5 , characterized in that a material whose reliability is more easily affected by crystal defects than the case of using InGaAsP, is applied as an active layer of the semiconductor laser.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: LUMENTUM JAPAN, INC.
To: LUMENTUMRADIANT GMBH
Reel/Frame 073971/0379 →
CHANGE OF NAME Recorded Jul 2, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 049669/0609 →
CHANGE OF NAME Recorded Dec 3, 2014
From: OPNEXT JAPAN, INC.
To: OCLARO JAPAN, INC.
Reel/Frame 034524/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2007
From: KAMIYAMA, HIROYUKI; MUKAIKUBO, MASARU; INOUE, HIROAKI; KITAHARA, CHIYUKI
To: OPNEXT JAPAN, INC.
Reel/Frame 020300/0310 →