Semiconductor integrated circuit
View Patent ↗When dummy patterns are arranged to planarize LSI layout patterns, a plurality of dummy patterns 1 are arranged in a wiring layer in which signal wiring patterns 2 are formed, so as to be inclined at an angle of generally 45 degrees toward the associated signal wiring patterns 2 . These dummy patterns 1 cross signal wiring patterns 3 formed in another vertically adjacent wiring layer to have an inclination angle of generally 45 degrees. A plurality of dummy patterns 13 are located in the wiring layer in which the signal wiring patterns 3 are formed, so as to be inclined at an angle of generally 45 degrees toward the associated signal wiring patterns 3 . The dummy patterns 1 formed in one of the adjacent wiring layers cross the dummy patterns 13 formed in the other wiring layer at an angle of generally 90 degrees. This reduces fluctuations in wiring capacitance and equalizes fluctuations in the wiring capacitance to the maximum extent.
1. A semiconductor integrated circuit comprising a real pattern group including a plurality of wiring patterns for providing connection either between a pair of circuits, between a pair of elements or between a circuit and an element, the real pattern group being formed in each of a plurality of wiring layers, and a plurality of dummy patterns formed in a region of each said wiring layer in which the real pattern group is not placed,
wherein, when the direction of extension of one of the plurality of wiring patterns is used as a reference direction, the plurality of dummy patterns extend in a direction forming an angle of 45 degrees with respect to the reference direction, and
the plurality of dummy patterns include a potential-fixed dummy pattern connected to a fixed potential and floating dummy patterns prevented from being connected to a fixed potential, some of the floating dummy patterns are located adjacent to the associated wiring patterns, and one of the dummy patterns adjacent to said some of the floating dummy patterns located adjacent to the associated wiring patterns is the potential-fixed dummy pattern.
2. The semiconductor integrated circuit of claim 1 , wherein some of the plurality of dummy patterns adjacent to any one of the plurality of wiring patterns are located the same distance away from said any one of the plurality of wiring patterns.
3. The semiconductor integrated circuit of claim 1 , wherein the plurality of dummy patterns are rectangular.
4. The semiconductor integrated circuit of claim 3 , wherein the plurality of dummy patterns include a plurality of rectangles having different sizes.
5. The semiconductor integrated circuit of claim 1 , wherein some of the plurality of dummy patterns formed in one of the plurality of wiring layers cross some other ones of the plurality of dummy patterns formed in vertically adjacent one of the plurality of wiring layers at an angle of 90 degrees.
6. The semiconductor integrated circuit of claim 1 , wherein the floating dummy patterns make up 50% or more of the number of the plurality of dummy patterns.
7. The semiconductor integrated circuit of claim 1 , wherein the fixed potential is a power supply potential or a ground potential.
8. A semiconductor integrated circuit comprising a real pattern group including a plurality of wiring patterns for providing connection either between a pair of circuits, between a pair of elements or between a circuit and an element, the real pattern group being formed in each of a plurality of wiring layers, and a plurality of dummy patterns formed in a region of each said wiring layer in which the real pattern group is not placed,
wherein, when the direction of extension of one of the plurality of wiring patterns is used as a reference direction, the plurality of dummy patterns are a plurality of inclined dummy patterns inclined at a predetermined angle toward the reference direction,
some of the plurality of inclined dummy patterns formed in a first wiring layer of the plurality of wiring layers cross some of the wiring patterns formed in a second wiring layer different from the first wiring layer when viewed in plane, and
the plurality of dummy patterns include a potential-fixed dummy pattern connected to a fixed potential and floating dummy patterns prevented from being connected to a fixed potential, some of the floating dummy patterns are located adjacent to the associated wiring patterns, and one of the dummy patterns adjacent to said some of the floating dummy patterns located adjacent to the associated wiring patterns is the potential-fixed dummy pattern.
9. A semiconductor integrated circuit comprising a real pattern group including a plurality of wiring patterns for providing connection either between a pair of circuits, between a pair of elements or between a circuit and an element, the real pattern group being formed in each of a plurality of wiring layers, and a plurality of dummy patterns formed in a region of each said wiring layer in which the real pattern group is not placed,
wherein, when the direction of extension of one of the plurality of wiring patterns is used as a reference direction, the plurality of dummy patterns are a plurality of inclined dummy patterns inclined at a predetermined angle toward the reference direction,
some of the plurality of inclined dummy patterns are located the same distance away from one of the wiring patterns formed in one of the wiring layers in which said some of the plurality of inclined dummy patterns are formed, and
the plurality of dummy patterns include a potential-fixed dummy pattern connected to a fixed potential and floating dummy patterns prevented from being connected to a fixed potential, some of the floating dummy patterns are located adjacent to the associated wiring patterns, and one of the dummy patterns adjacent to said some of the floating dummy patterns located adjacent to the associated wiring patterns is the potential-fixed dummy pattern.