IP Library Granted Patent US 8,254,983
Granted Patent B2
US 8,254,983 · App. 11/888,067 · Granted Aug 28, 2012

Communication device with millimeter wave intra-device communication and methods for use therewith

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Quick Facts
Patent No.
US 8,254,983
App. No.
11/888,067
Granted
Aug 28, 2012
Kind
B2
Abstract

A communication device has a plurality of circuit modules including a processing module, a memory module and a wireless telephony transceiver for communicating with a network in accordance with a wireless telephony protocol. An RF data bus communicates first data between at least two of the plurality of circuit modules over a first millimeter wave communication path.

Claims (43)

1. A communication device comprising:

a plurality of circuit modules including a processing module, a memory module and a wireless telephony transceiver for communicating with a network in accordance with a wireless telephony protocol, wherein at least two of the plurality of circuit modules each include a millimeter wave transceiver;

a radio frequency (RF) data bus that communicates first data between at least two of the plurality of circuit modules over a first millimeter wave communication path that operates in a 60 GHz frequency band via the millimeter wave transceiver of each of the plurality of circuit modules; and

a millimeter wave modem coupled to receive second data from at least one external device and to transmit the second data over the RF data bus to at least one of the plurality of circuit modules, wherein the millimeter wave modem receives the second data over a second millimeter wave communication path.

2. The communication device of claim 1 wherein the at least two of the plurality of circuit modules include:

a protocol conversion module coupled to convert the first data to a millimeter wave protocol for transmission over the RF data bus.

3. The communication device of claim 1 wherein the millimeter wave modem includes:

at least one millimeter wave transceiver that receives the second data over the second millimeter wave communication path and transmits the second data over the first millimeter wave communication path; and

a first protocol conversion module coupled to convert the second data to the millimeter wave protocol for transmission over the RF data bus.

4. The communication device of claim 1 wherein the millimeter wave modem is further coupled to receive third data from at least one of the plurality of circuit modules via the RF data bus, and to send the third data to the at least one external device.

5. The communication device of claim 4 wherein the at least one millimeter wave transceiver receives the third data over the first millimeter wave communication path and transmits the third data over the second millimeter wave communication path, and wherein the millimeter wave modem includes:

a second protocol conversion module coupled to convert the third data from the millimeter wave protocol for transmission to the at least one external device.

6. The communication device of claim 1 includes a RF data bus controller having:

an interface for communicating RF data bus access requests and allocations; and

a controller module coupled to:

receive an access request to the RF data bus via the interface;

determine RF data bus resource availability; and

when sufficient RF data bus resources are available to fulfill the access request, allocate, via the interface, at least one RF data bus resource in response to the access request.

7. The communication device of claim 6 wherein the interface receives the RF data bus access request from the plurality of circuit modules.

8. The communication device of claim 6 wherein the interface receives the RF data bus access request from at least one external device.

9. The communication device of claim 1 wherein the first millimeter wave communication path includes a wave guide.

10. The communication device of claim 1 wherein the first millimeter wave communication path includes a free space communication path.

11. A method comprising:

communicating, over a first millimeter wave communication path of a radio frequency (RF) data bus, first data between a plurality of circuit modules including a processing module, a memory module and a wireless telephony transceiver, wherein each of the plurality of circuit modules includes a corresponding millimeter wave transceiver for communicating to and from the RF data bus;

converting the first data to the millimeter wave protocol for transmission over the RF data bus;

receiving second data from at least one external device; and

transmitting the second data over the RF data bus to at least one of the plurality of circuit modules;

wherein the first millimeter wave communication path operates in a 60 GHz frequency band.

12. The method of claim 11 further comprising:

receiving the second data over a second millimeter wave communication path.

13. The method of claim 11 further comprising:

converting the second data to the millimeter wave protocol for transmission over the RF data bus.

14. The method of claim 11 further comprising:

receiving third data from at least one of the plurality of circuit modules via the RF data bus; and

sending the third data to the at least one external device.

15. The method of claim 14 further comprising:

converting the third data from the millimeter wave protocol for transmission to the at least one external device.

16. The method of claim 11 further comprising:

receiving an access request to access the RF data bus;

determining RF data bus resource availability; and

when sufficient RF data bus resources are available to fulfill the access request, allocating at least one RF data bus resource in response to the access request.

17. The method of claim 16 wherein the RF data bus access request is received from at least one of the plurality of circuit modules.

18. The method of claim 16 wherein the RF data bus access request is received from at least one external device.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 09/05/2018 PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0133. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0456 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0133 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2007
From: ROFOUGARAN, AHMADREZA REZA
To: BROADCOM CORPORATION
Reel/Frame 019895/0720 →