Lead frame package apparatus and method
The present disclosure relates to a lead frame package comprising a die attach pad and two or more electrical interconnections, wherein at least one of the two or more interconnections is affixed to the die attach pad for electrically grounding the lead frame package. The present disclosure further relates to a method for providing a lead frame package. The lead frame package comprises two or more electrical interconnections and a die attach pad. At least one electrical interconnection is affixed to the die attach pad to ground the lead frame package and at least one of the electrical interconnections is an RF signal interconnection. At least one of the die attach pad and the at least one grounding electrical interconnection is connected to a grounding contact of a circuit-board. The at least one RF signal electrical interconnection is connected to an RF signal contact on the circuit-board, thereby forming a mounted semi-conductor circuit.
1 . A lead frame package comprising:
a die attach pad; and
two or more electrical interconnections, wherein at least one of the interconnections is affixed to the die attach pad for electrically grounding the lead frame package.
2 . The lead frame package of claim 1 , wherein at least one of the interconnections is a radio-frequency (RF) signal interconnection.
3 . The lead frame package of claim 2 , wherein at least one of the interconnections is affixed to the die attach pad via one or more ties bars.
4 . The lead frame package of claim 1 , comprising three or more electrical interconnections, wherein at least one of the interconnections is a signal interconnection and at least two other interconnections are grounding interconnections affixed to the die attach pad, the at least one signal interconnection being positioned between the at least two grounding interconnections.
5 . The lead frame package of claim 4 , wherein the at least one signal interconnection is an RF signal interconnection.
6 . A method of manufacturing a lead frame package comprising:
providing a lead frame package, the lead frame package comprising two or more electrical interconnections and a die attach pad, wherein at least one electrical interconnection is affixed to the die attach pad to ground the lead frame package and wherein at least one of the electrical interconnections is an RF signal interconnection;
connecting at least one of the die attach pad and the at least one grounding electrical interconnection to a grounding contact of a circuit-board; and
connecting the at least one RF signal electrical interconnection to an RF signal contact on the circuit-board, thereby forming a mounted semi-conductor circuit.
7 . The method of claim 6 , wherein the die attach pad is affixed to the at least one electrical interconnection via one or more tie bars.
8 . The method of claim 6 , wherein the lead frame package comprises three or more electrical interconnections, at least two of which are affixed to the die attach pad via one or more tie bars.
9 . The method of claim 8 wherein the at least one RF interconnection is positioned between at least two grounding electrical interconnections.
10 . The method of claim 9 , further comprising:
attaching the lead frame package to a circuit-board, such that the at least two grounding electrical interconnections are connected to grounding contacts on the circuit-board, and the at least one designated RF signal interconnections is connected to an RF signal contact on the circuit-board.