Diagnostic ultrasound transducer
View Patent ↗An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member.
1. A ultrasound imaging transducer comprising:
an array of electro-acoustic elements;
a backing block on which the array is mounted;
for each electro-acoustic element, an area of electrically conductive material on a corresponding portion of a contact surface of the backing block and in electrical contact with the electro-acoustic element;
a circuit substrate secured to the backing block and extending in a longitudinal direction substantially perpendicular to the contact surface; and
for each electro-acoustic element, at least one electrically conductive trace on the circuit board and in electrical contact with the corresponding contact surface portion and thereby with the electro-acoustic element;
at least one acoustic matching layer mounted on a transmitting surface of the electro-acoustic element;
at least one metallic member mounted on a lateral surface of the backing block and extending in a longitudinal direction at least as far distally as a distal surface of the electro-acoustic elements; and
a thermally conductive, metallic layer located between the at least one acoustic matching layer the electro-acoustic element and in contact with the metallic member;
said at least one metallic member thereby forming a heat sink for heat flowing through the thermally conductive, metallic layer, as well as laterally from the electro-acoustic elements.
2. The assembly of claim 1 , in which:
the backing block has a planar, non-recessed distal surface on which the array is mounted;
the array is mounted on the distal surface of the backing block;
the circuit substrate is a substantially rigid printed circuit board (PCB) embedded within the backing block and extending in a longitudinal direction substantially perpendicular to the contact surface.
3. The assembly of claim 1 , in which the electrically conductive material is sputtered onto the contact surface of the backing block.
4. The assembly of claim 1 , in which each metallic member is located on a respective side surface of the backing block, extends substantially perpendicular to the contact surface and distally at least as far as the array, and forms a common electrical ground contact for the electro-acoustic elements.
5. The assembly of claim 4 , in which each metallic member is in physical and thereby thermal contact with lateral surfaces of the electro-acoustic elements.
6. The assembly of claim 4 , further comprising lateral gaps on either side of each electro-acoustic element between the electro-acoustic element and the metallic member, the element thereby being physically separated from the metallic member but the metallic member still receiving heat from the element.
7. The assembly of claim 4 , in which the metallic member is formed of two laterally opposing plate-like elements.
8. The assembly of claim 4 , in which the metallic members are portions of a single metallic piece extending on either side of and across a proximal surface of the backing block.
9. The assembly of claim 1 , in which the electro-acoustic element is made of lead zirconate titanate (PZT).
10. The assembly of claim 1 , further comprising an acoustic lens mounted longitudinally outward on the matching layer(s).
11. The assembly of claim 1 , in which the metallic layer is metallic foil.
12. A ultrasound imaging transducer comprising:
an array of electro-acoustic elements;
a backing block with a planar, non-recessed distal surface on which the array is mounted;
for each electro-acoustic element, an area of electrically conductive material on a corresponding portion of a contact surface of the backing block and in electrical contact with the electro-acoustic element;
a substantially rigid printed circuit board (PCB) embedded within the backing block and extending in a longitudinal direction substantially perpendicular to the contact surface; and
for each electro-acoustic element, at least one electrically conductive trace on the circuit board and in electrical contact with the corresponding contact surface portion and thereby with the electro-acoustic element, a solder-free electrical signal path thereby being formed through the trace to the electro-acoustic element;
metallic members mounted on opposing lateral surfaces of the backing block, each extending in a longitudinal direction at least as far distally as a distal surface of the electro-acoustic elements and forming a common electrical ground contact;
at least one acoustic matching layer mounted on a transmitting surface of the electro-acoustic element;
an acoustic lens mounted longitudinally outward on the matching layer(s); and
a thermally conductive, metallic layer located between the at least one acoustic matching layer the electro-acoustic element and in contact with the metallic member;
said at least one metallic member thereby forming a heat sink for heat flowing through the thermally conductive, metallic layer, as well as laterally from the electro-acoustic elements.
13. The assembly of claim 12 , in which the metallic members are portions of a single metallic piece extending on either side of and across a proximal surface of the backing block.