Pad structure for liquid crystal display and method of manufacturing thereof
View Patent ↗A liquid crystal display has a pad structure. The pad structure includes at least one pad formed on a substrate, an insulating film formed on the pad, and at least one conductive layer connected to the pad through contact holes defined through the insulating film. The insulating film covers side surfaces of the pad and a portion of the substrate adjacent to the side surfaces of the pad.
1. A method for manufacturing a liquid crystal display having, the method comprising the steps of:
forming gate pads on a substrate;
forming an insulating film to cover the gate pads;
forming a protective film on the insulating film;
forming a plurality of contact holes to expose portions of the gate pads in the insulating film and the protective film;
forming a transparent conductive layer on the protective film wherein the transparent conductive layer electrically contacts the exposed portions of the gate pads via the plurality of contact holes; and
forming an anisotropic conductive film on the transparent conductive layer wherein edge portions of the transparent conductive layer are covered by the anisotropic conductive film.
2. The method according to claim 1 , wherein the edge portions of the gate pad are covered by the insulating film.
3. The method according to claim 2 , wherein the step of forming the insulating film further includes covering a portion of the substrate adjacent to the side surfaces of the gate pad with the insulating film.
4. A method for manufacturing a liquid crystal display, the method comprising the steps of:
forming an insulating film on a plurality of gate pads;
forming data pads on the insulating film;
forming a protective film on the data pads;
forming a plurality of contact holes to expose portions of the date pads in the protective film;
forming a transparent conductive layer on the protective film, wherein the transparent conductive layer electrically contacts the exposed portions of the data pads via the plurality of contact holes; and
forming an anisotropic conductive film on the transparent conductive layer, wherein edge portions of the transparent conductive layer are covered by the anisotropic conductive film.
5. The method according to claim 1 , the transparent conductive layer includes indium tin oxide.
6. The method according to claim 4 , wherein the edge portions of the gate pad are covered by the protective film.