Integrated circuit and DC-DC converter formed by using the integrated circuit
View Patent ↗An integrated circuit, in which the influence of parasitic capacitance between a semiconductor substrate and a resistor and between the semiconductor substrate and a capacitor can be inhibited, and a DC-DC converter provided with the integrated circuit. A shielding layer of an n-type semiconductor is formed between a p-type semiconductor substrate and a resistor formed thereon and between the semiconductor substrate and a capacitor formed thereon. A point BOOT is connected to the shielding layer, at which an electric potential changes in the same way as a change in the reference potential of a functional circuit carrying out a specified operation by using the resistor and the capacitor.
1. An integrated circuit comprising:
a semiconductor substrate;
a shielding layer;
a circuit element formed on the shielding layer;
a functional circuit carrying out a specified operation with the use of the circuit element; and
an n-channel MOS transistor,
wherein the shielding layer is connected either to a reference potential of the functional circuit or to a point having an electric potential that changes in accordance with a change in the reference potential, and the reference potential is changed by turning the MOS transistor on and off;
wherein the MOS transistor has a drain terminal, to which an input voltage is applied, and has a gate terminal and a source terminal;
wherein the source terminal of the MOS transistor is connected to a coil, and the coil is connected to a capacitor, to which capacitor an output voltage is applied,
wherein the functional circuit is connected to the gate terminal of the MOS transistor, and carries out an operation with the use of the circuit element, and
wherein the MOS transistor is driven by the functional circuit for obtaining a specified output voltage from the input voltage.
2. The integrated circuit according to claim 1 , further comprising:
a bootstrap circuit in which a reference potential thereof is taken as the electric potential of the source terminal of the MOS transistor; wherein:
the functional circuit is operated with an electric potential of a high electric potential side of a power source thereof taken as an electric potential on a high electric potential side of the bootstrap circuit and an electric potential of a low electric potential side of the power source thereof taken as the reference potential; and
the shielding layer is connected either to the reference potential or to the high electric potential of the bootstrap circuit.
3. The integrated circuit according to claim 2 , further comprising an overcurrent protection circuit formed with a second one of the circuit element included in the integrated circuit provided for preventing an overcurrent from flowing in the MOS transistor, a reference potential of the overcurrent protection circuit being connected to the reference potential of the bootstrap circuit.
4. The integrated circuit according to claim 1 , wherein the shielding layer comprises a diffused layer formed in the semiconductor substrate.
5. The integrated circuit according to claim 1 , wherein the shielding layer comprises a conductive film formed on the semiconductor substrate.
6. The integrated circuit according to claim 5 , wherein the conductive film is a metal film.