IP Library › Granted Patent US 8,158,892
Granted Patent B2
US 8,158,892 · App. 11/891,785 · Granted Apr 17, 2012

High-speed router with backplane using muli-diameter drilled thru-holes and vias

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Quick Facts
Patent No.
US 8,158,892
App. No.
11/891,785
Granted
Apr 17, 2012
Kind
B2
Abstract

A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.

Claims (35)

1. A circuit board comprising:

a plurality of conductive layers separated by insulating layers, at least some of the conductive layers patterned to contain traces; and

a first hole through the circuit board and having a conductive liner in a first longitudinal segment of the hole, the conductive liner electrically connected to a first one of the traces on at least a first one of the conductive layers, the hole having a second longitudinal segment with no conductive liner, adjacent to a first end of the hole, the second longitudinal segment of the hole comprising at least one transition from a first profile adjacent the first end of the hole to a second profile longitudinally separated from the first end of the hole; wherein the first and second longitudinal segments are or equal or unequal length.

2. The circuit board of claim 1 , wherein the first hole is a thru-hole providing an electrical connection to a first component mated to the circuit board.

3. The circuit board of claim 2 , wherein the first component is mated to the circuit board on a side opposite the first end of the thru-hole.

4. The circuit board of claim 1 , wherein the hole is a via providing an electrical connection between the first one of the traces and a second one of the traces located on a second one of the conductive layers.

5. The circuit board of claim 4 , the via having a third longitudinal segment with no conductive liner, adjacent to a second end of the hole, the third longitudinal segment comprising at least one transition from a third profile adjacent the second end of the hole to a fourth profile longitudinally separated from the second end of the hole.

6. The circuit board of claim 5 , wherein the first and third profiles are substantially equivalent and the second and fourth profiles are substantially equivalent.

7. The circuit board of claim 1 , wherein a length of the second longitudinal segment is substantially equal to a longitudinal depth of the first one of the conductive layers from the first end of the hole, minus a stop clearance.

8. The circuit board of claim 1 , wherein the first and second profiles are substantially round, the first profile having a diameter at least ten percent greater than the second profile.

9. The circuit board of claim 1 , wherein the transition between the first and second profiles occurs approximately midway along the length of the second longitudinal segment.

10. The circuit board of claim 1 , wherein a length of a section of the second longitudinal segment having the second profile is related to a primary radio frequency energy component to be suppressed, with the length of the section being substantially different from any integer number of half-wavelengths of the primary radio frequency.

11. The circuit board of claim 1 , wherein a length of a section of the second longitudinal segment having the first profile is related to a primary radio frequency energy component to be suppressed, with the length of the section is substantially different from any integer number of half-wavelengths of the primary radio frequency.

12. The circuit board of claim 1 , wherein a length of a section of the second longitudinal segment having the second profile is related to a primary radio frequency energy component to be suppressed, with the length of the section being substantially equal to a quarter-wavelength of the primary radio frequency.

13. The circuit board of claim 1 , wherein the first hole is a thru-hole providing an electrical connection to a first component mated to the circuit board, the circuit board further comprising a second thru-hole providing an electrical connection to a second component mated to the circuit board, the second thru-hole having a conductive liner in a first longitudinal segment of the second hole and electrically connected to one of the traces on one of the conductive layers, the second thru-hole having a second longitudinal segment with no conductive liner, adjacent to a first end of the second hole, the second longitudinal segment of the second hole comprising at least one transition from the first profile adjacent the first end of the second hole to the second profile longitudinally separated from the first end of the second hole.

14. The circuit board of claim 13 , wherein the first and second thru-holes are substantially similar and connected to opposite ends of the first one of the traces.

15. The circuit board of claim 13 , wherein the trace connected to the second thru-hole is a second trace on a second one of the conductive layers.

16. The circuit board of claim 15 , wherein a length of a second longitudinal segment of the first thru-hole is substantially equal to the longitudinal depth of the first one of the conductive layers from the first end of the first hole minus a stop clearance, and a length of a second longitudinal segment of the second thru-hole is substantially equal to the longitudinal depth of the second one of the conductive layers from the first end of the second hole minus the stop clearance.

17. The circuit board of claim 16 , wherein for the second longitudinal segments of the first and second holes, the lengths of the segments having the second hole profile are each substantially equal to half the respective lengths of the second longitudinal segments.

18. The circuit board of claim 16 , wherein for the second longitudinal segments of the first and second holes, a length of a section of the second longitudinal segments of the first and second holes having the second profile are substantially equal.

19. The circuit board of claim 15 , further comprising a via providing an electrical connection between the first one of the traces and the second one of the traces.

20. The circuit board of claim 19 , the via having a conductive liner in a first longitudinal segment of the via and electrically connected to the first and second traces, the via having a second longitudinal segment with no conductive liner, adjacent to a first end of the via, the second longitudinal segment of the via comprising at least one transition from a third profile adjacent the first end of the via to a fourth profile longitudinally separated from the first end of the via.

21. The circuit board of claim 20 , the via having a third longitudinal segment with no conductive liner, adjacent to the second end of the via, the third longitudinal segment comprising at least one transition from the third profile adjacent the second end of the hole to the fourth profile longitudinally separated from the second end of the hole.

22. The circuit board of claim 20 , the conductive liner in the first longitudinal segment of the via passing through a nonfunctional conductive pad on at least one of the conductive layers.

23. A circuit board comprising:

a plurality of conductive trace layers and a plurality of conductive ground plane layers separated by insulating layers, the conductive trace layers arranged such that they are each positioned between a pair of ground plane layers, the conductive trace layers each comprising a plurality of differential signaling trace pairs; and

a plurality of hole pairs positioned at the termination points of the differential trace pairs, at least a first subset of the holes having a partial conductive liner electrically contacting the differential trace pair termination point associated with those holes, the holes in the first subset each comprising an end section with no conductive liner, the end section comprising at least one transition from a first profile to a second profile, wherein the hole pairs included in the first subset consist of hole pairs that are substantially identical to each other.

24. The circuit board of claim 23 , wherein the first subset of the holes comprises signaling thru-holes mated to components on a top side of the circuit board and coupled to conductive trace layers positioned in the top half of the circuit board.

25. The circuit board of claim 24 , at least a second subset of the holes comprising signaling thru-holes mated to components on a top side of the circuit board and coupled to conductive trace layers positioned in the bottom half of the circuit board, the second subset of the holes having a complete conductive liner.

26. The circuit board of claim 25 , the second subset of the holes passing through and electrically connected to nonfunctional conductive pads on selected ones of the conductive ground plane layers.

27. The circuit board of claim 23 , wherein a second subset of the first subset of the holes comprises via pairs, each via in each such pair having a partial conductive liner electrically contacting two differential trace pair termination points on two different conductive trace layers.

28. The circuit board of claim 27 , wherein when the two different conductive trace layers exist in the top half of the circuit board, the end section of the via with no conductive liner is formed in the bottom end of the circuit board, and when the two different conductive trace layers exist in the bottom half of the circuit board, the end section of the via with no conductive liner is formed in the top end of the circuit board.

29. The circuit board of claim 27 , wherein the via pairs have an end section with no conductive liner that is of a different length than the end section of the other holes in the first subset.

30. The circuit board of claim 23 , wherein the transition from the first profile to a second profile occurs approximately midway along the end section in each hole of the first subset.

31. A router comprising the circuit board of claim 23 .

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
MERGER Recorded Mar 4, 2021
From: FORCE10 NETWORKS, INC.
To: DELL MARKETING CORPORATION
Reel/Frame 056104/0988 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040040/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0618 →
RELEASE OF SECURITY INTEREST Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLANT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0216 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jan 2, 2014
From: APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 031897/0348 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031898/0001 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031899/0261 →