Substrate bonding machine for liquid crystal display device

1. A substrate bonding device for fabricating a liquid crystal display (LCD) panel, comprising:

a base frame;

a lower chamber unit mounted to the base frame, wherein the lower chamber unit defines a lower interior space and includes an upper surface;

an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit defines an upper interior space, includes a lower surface, and is joinable to the lower chamber unit;

chamber moving means for raising and lowering the upper chamber unit;

an upper stage arranged within the upper interior space for securing a first substrate;

a lower stage arranged within the lower interior space for securing a second substrate, at least one of the upper and lower stages including an electrostatic chuck for applying an electrostatic charge to secure a corresponding one of the first and second substrates;

alignment cameras provided to at least one of the upper and lower chamber units for verifying an alignment state of a plurality of alignment marks formed on the first and second substrates;

alignment means arranged at side portions of the lower chamber unit for adjusting an alignment between the first and second substrates; and

interlocking means provided to the chamber units for coupling the upper chamber unit to the lower chamber unit;

and first and second reels arranged with respect to the surface of the upper stage.

2. The substrate bonding device as claimed in claim 1 , wherein the first and second reels are arranged elevationally higher than the surface of the upper stage.

3. A substrate bonding device for fabricating a liquid crystal display device (LCD), comprising:

a base frame;

a lower chamber unit mounted to the base frame, wherein the lower chamber unit defines a lower interior space and includes an upper surface;

an upper chamber unit arranged over the lower chamber unit, wherein the upper chamber unit defines an upper interior space, includes a lower surface, and is joinable to the lower chamber unit; chamber moving means for raising and lowering the upper chamber unit;

an upper stage arranged within the upper interior space for securing a first substrate;

a lower stage arranged within the lower interior space for securing a second substrate;

a sealing means provided to at least one of the upper and lower surfaces for sealing an interior space surrounding the first and second substrates, wherein the sealed interior space is definable by joined ones of the upper and lower chamber units; and

a case for enclosing the upper and lower chamber units,

wherein the case includes a transparent material, wherein an inside of the substrate bonding device is observable from outside the case through the transparent material and first and second reels arranged with respect to the surface of the upper stage.

4. The substrate bonding device as claimed in claim 3 , wherein the first and second reels are arranged elevationally higher than the surface of the upper stage.

5. The substrate bonding device as claimed in claim 1 , wherein the electrostatic chuck includes polyimide.