Methods and apparatus for packaging integrated circuit devices
View Patent ↗An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and semiconductor circuitry formed over the first generally planar surface, at least one chip scale packaging layer formed over the semiconductor circuitry and the first generally planar surface, an insulation layer formed over the second generally planar surface and the edge surfaces and at least one electrical conductor formed directly on the insulation layer overlying the second generally planar surface, the at least one electrical conductor being connected to the circuitry by at least one pad formed directly on the first generally planar surface.
1. A method of producing integrally packaged optronic integrated circuit devices, comprising:
providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
separating said integrated circuit dies from each other along said dice lines so as to define edge surfaces of said dies while said dies remain attached to said packaging layer;
forming first and second electrical conductors overlying said second generally planar surface and said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surface of said dies; and
severing said package layer and defining a plurality of packaged optronic integrated circuit devices.
2. A method of producing integrally packaged optronic integrated circuit devices, comprising:
providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
separating said integrated circuit dies from each other along said dice lines so as to define edge surfaces of said dies while said dies remain attached to said packaging layer;
forming first and second electrical conductors overlying at least one of said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surfaces of said dies; and
severing said packaging layer and defining a plurality of packaged optronic integrated circuit devices.
3. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , wherein said packaging layer is formed of a material selected from the group consisting of glass, quartz, and sapphire.
4. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , further comprising forming an insulation layer over said second generally planar surface and said edge surfaces and underlying said electrical conductors.
5. A method of producing integrally packaged optronic integrated circuit devices according to claim 4 , wherein said insulation layer comprises a mechanically conforming layer.
6. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , wherein the step of forming said electrical conductors comprises forming portions of said electrical conductors generally parallel to and in touching electrical engagement with planar surfaces of said projecting portions of said pads.
7. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , wherein the step of forming said packaging layer comprises adhering said packaging layer to said first generally planar surface using a bonding layer.
8. A method of producing integrally packaged optronic integrated circuit devices according to claim 7 , wherein said bonding layer has spectral filter functionality.
9. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , wherein the step of forming said packaging layer also comprises providing at least one spectral filter.
10. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , wherein the step of providing said packaging layer also comprises forming color array filters.
11. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , wherein the step of forming said packaging layer also comprises providing a lens integrally formed with said packaging layer.
12. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , wherein the step of forming said packaging layer also comprises providing light coupling bumps overlying said first generally planar surface.
13. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , wherein the step of forming said packaging layer further comprises forming a waveguide and other optical components.
14. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , wherein the step of forming said packaging layer further comprises providing an optical grating.
15. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , wherein the step of forming said packaging layer further comprises providing a polarizer overlying said first generally planar surface.
16. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , further comprising forming a trench between different elements on at least one of said integrated circuit dies.
17. A method of producing integrally packaged optronic integrated circuit devices according to claim 1 or claim 2 , further comprising inserting a spacer element over said optronic semiconductor circuitry and said first generally planar surface prior to the step of forming said packaging layer.
18. A method of producing integrally packaged optronic integrated circuit devices, comprising:
providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
separating said integrated circuit dies from each other along said dice lines so as to define edge surfaces of said dies; and
forming first and second electrical conductors overlying said second generally planar surface and said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surface of said dies.
19. A method of producing integrally packaged optronic integrated circuit devices, comprising:
providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
separating said integrated circuit dies from each other along said dice lines so as to define edge surfaces of said dies; and
forming first and second electrical conductors overlying at least one of said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surfaces of said dies.
20. A method of producing integrally packaged optronic integrated circuit devices, comprising:
providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
processing said wafer to define edge surfaces of said dies while said dies remain attached to said packaging layer so as to define edge surfaces of said dies while said dies remain attached to said packaging layer;
forming first and second electrical conductors overlying said second generally planar surface and said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surface of said dies; and
severing said package layer and defining a plurality of packaged optronic integrated circuit devices.
21. A method of producing integrally packaged optronic integrated circuit devices, comprising:
providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
processing said wafer to define edge surfaces of said dies while said dies remain attached to said packaging layer so as to define edge surfaces of said dies while said dies remain attached to said packaging layer;
forming first and second electrical conductors overlying at least one of said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surfaces of said dies; and
severing said packaging layer and defining a plurality of packaged optronic integrated circuit devices.