Manufacturing method of color filter substrate

1. A manufacturing method of a color filter substrate, comprising:

forming a black matrix on a substrate, the black matrix including first, second, third and fourth openings;

forming first, second and third color filter patterns in the first, second and third openings;

forming an overcoat layer on the substrate including the first, second and third color filter patterns;

disposing a soft mold on the overcoat layer, the soft mold including first depressed portions and a second depressed portion, the first depressed portions in locations corresponding to the black matrix, and the second depressed portion in a location corresponding to the fourth opening, wherein a first depth of the first depressed portions is larger than a second depth of the second depressed portion;

applying pressure to the soft mold such that the first and second depressed portions are filled with the overcoat layer, the overcoat layer including a first part on the black matrix, a second part in the fourth opening, and a third part on the first, second and third color filter patterns, wherein the first part includes patterned spacers corresponding to the first depressed portions and having a first height and the second part includes a convex portion corresponding to the second depressed portion and having a second height;

first curing the overcoat layer with the soft mold disposed thereon;

detaching the soft mold from the overcoat layer; and

second curing the overcoat layer.

2. The method according to claim 1 , wherein the first curing the overcoat layer includes irradiating ultraviolet light onto the overcoat layer.

3. The method according to claim 2 , wherein the second curing the overcoat layer includes heating the overcoat layer.

4. The method according to claim 1 , wherein the second part of the overcoat layer has a first thickness and the third part of the overcoat layer has a second thickness smaller than the first thickness.

5. The method according to claim 4 , wherein the second height of the convex portion is a difference between the first thickness and the second thickness times a contraction rate of the overcoat layer after second curing the overcoat layer.

6. The method according to claim 1 , wherein the second part has a top surface higher than a top surface of the third part.

7. The method according to claim 6 , wherein the overcoat layer is second cured such that the second part has the top surface on a level with the top surface of the third part.

8. The method according to claim 1 , wherein the patterned spacers have a third height lower than the first height after second curing the overcoat layer.

9. The method according to claim 8 , wherein the third height of the patterned spacers is within a range of 2 μm to 4 μm.

10. The method according to claim 9 , wherein the first depth of the first depressed portions is a sum of the third height and a shrinkage value that is the third height times a contraction rate of the overcoat layer after the second curing the overcoat layer.

11. The method according to claim 1 , wherein the soft mold is fabricated by a method including:

forming an inorganic material layer on a base substrate having a flat surface;

forming first photoresist patterns and a second photoresist pattern on the inorganic material layer, wherein the first photoresist patterns are thicker than the second photoresist pattern;

forming first inorganic material patterns and a second inorganic material pattern by etching the inorganic material layer using the first and second photoresist patterns as an etching mask, the first inorganic material patterns corresponding to the first photoresist patterns, and the second inorganic material pattern corresponding to the second photoresist pattern;

removing the second photoresist pattern to thereby expose the second inorganic material pattern;

partially etching the second inorganic material pattern;

removing the first photoresist patterns to thereby form first embossed portions and a second embossed portion corresponding to the first inorganic material patterns and the second inorganic material pattern, respectively;

forming an organic material layer on the base substrate including the first and second embossed portions;

curing the organic material layer; and

detaching the cured organic material layer from the base substrate to thereby complete the soft mold, wherein the first depressed portions correspond to the first embossed portions, and the second depressed portion corresponds to the second embossed portion.

12. The method according to claim 1 , wherein the soft mold is fabricated by a method including:

forming a photoresist layer on a base substrate having a flat surface;

exposing the photoresist layer to light through a mask;

forming first embossed portions and a second embossed portion by developing the photoresist layer, wherein the first embossed portions are thicker than the second embossed portion;

forming an organic material layer on the base substrate including the first and second embossed portions;

curing the organic material layer; and

detaching the cured organic material layer from the base substrate to thereby complete the soft mold, wherein the first depressed portions correspond to the first embossed portions, and the second depressed portion corresponds to the second embossed portion.