Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same
View Patent ↗A cleaning solution for cleaning a substrate for semiconductor devices and a cleaning method using the said cleaning solution, which comprises at least the following components (A), (B) and (C): (A) an ethyleneoxide-type surfactant containing a hydrocarbon group which may have a substituent group except for phenyl, and a polyoxyethylene group in which a ratio (m/n) of a number (m) of carbon atoms contained in the hydrocarbon group to a number (n) of oxyethylene groups contained in the polyoxyethylene group is in the range of 1 to 1.5, the number (m) of carbon atoms is not less than 9, and the number (n) of oxyethylene groups is not less than 7; (B) water; and (C) alkali or an organic acid.
1. A method for cleaning a substrate for semiconductor devices comprising:
chemical mechanical polishing a substrate for semiconductor devices which is provided on a partial or whole surface thereof with silicon, transition metals or transition metal compounds, and
cleaning the substrate using a cleaning solution,
said cleaning solution comprising at least the following components (A), (B) and (C):
(A) a polyoxyethylene alkyl ether surfactant containing a hydrocarbon group which may have a substituent group except for phenyl, and a polyoxyethylene group in which a ratio (m/n) of a number (m) of carbon atoms contained in the hydrocarbon group to a repeating number (n) of oxyethylene groups contained in the polyoxyethylene group is in the range of 1 to 1.2, the number (m) of carbon atoms is not less than 9, and in which the number of oxyethylene groups is 7 to 18;
(B) water; and
(C) an alkali.
2. A method according to claim 1 , wherein the cleaning solution further comprises a complexing agent.
3. A method according to claim 1 , wherein the cleaning solution has a pH value of not less than 9.
4. A method according to claim 1 , wherein the component (C) is represented by the general formula (I):
(R 1 ) 4 N 30 OH − (I)
wherein R 1 is a hydrogen atom or an alkyl group which may be substituted with hydroxyl, alkoxy or halogen, and the R 1 groups may be the same or different from each other.
5. A method according to claim 4 , wherein the component (C) is ammonium hydroxide or quaternary ammonium hydroxide having a C 1 to C 4 alkyl group or a hydroxyalkyl group.
6. A method according to claim 1 , wherein a content of the component (A) is 0.0001 to 0.5% by weight.
7. A method according to claim 1 , wherein the substrate is cleaned while irradiating a megasonic wave having a frequency of not less than 0.5 MHz thereto.
8. A method according to claim 1 , wherein the substrate after chemical mechanical polishing is subjected to brush cleaning.
9. A method according to claim 1 , wherein the cleaning solution is heated to a temperature of 40 to 70° C. upon use.
10. A method according to claim 1 , wherein after cleaning the substrate with the cleaning solution, the substrate is further heat-treated at a temperature of not less than 300 °C. or treated with ozone water.
11. A method according to claim 1 , wherein the substrate to be treated by the method has an insulating film having a water contact angle of not less than 60° on the surface thereof.
12. A method according to claim 1 , wherein the transition metal on the surface of substrate is copper.
13. A cleaning solution for cleaning a substrate for semiconductor devices, comprising at least the following components (A), (B) and (C):
(A) a polyoxyethylene alkyl ether represented by the following general formula (II):
R 2 —(CH 2 CH 2 O) n H (II)
wherein R 2 is an alkyl group which may be substituted with hydroxyl, amino, alkoxy or halogen; a ratio (m/n) of a number (m) of carbon atoms contained in the hydrocarbon group to a repeating number (n) of oxyethylene groups contained in the polyoxyethylene group is in the range of 1 to 1.2, the number (m) of carbon atoms is not less than 9, and in which the number of oxyethylene groups is 7 to 18;
(B) water; and
(C) an alkali.
14. A cleaning solution according to claim 13 , further comprises a complexing agent.
15. A cleaning solution according to claim 13 , having a pH value of not less than 9.
16. A cleaning solution according to claim 13 , wherein the component (C) is represented by the general formula (I):
(R 1 ) 4 N 30 OH − (I)
wherein R 1 is a hydrogen atom or an alkyl group which may be substituted with hydroxyl, alkoxy or halogen, and the R 1 groups may be the same or different from each other.
17. A cleaning solution according to claim 16 , wherein the component (C) is ammonium hydroxide or quaternary ammonium hydroxide having a C 1 to C 4 alkyl group or a hydroxyalkyl group.
18. A cleaning solution according to claim 13 , wherein a content of the component (A) is 0.0001 to 0.5% by weight.
19. A cleaning solution according to claim 13 , wherein the substrate for semiconductor devices which is provided on a partial or whole surface thereof with copper.