Debris removal in high aspect structures
View Patent ↗A method of debris removal is provided. The method includes positioning a nanometer-scaled tip adjacent to a piece of debris on a substrate. The method also includes adhering the piece of debris to the tip. In addition, the method also includes removing the piece of debris from the substrate by moving the tip away from the substrate.
1. A method for removing debris from a trench formed on a surface of a substrate, comprising:
positioning a tip, having a nanometer-scaled coating with a surface energy lower than the surface energy of the substrate, within the trench;
moving the tip within the trench to physically adhere the debris to the tip;
moving the tip with the adhered debris away from the trench; and
imbedding the debris in a patch of material, attached to a stage that supports the substrate, having a surface energy lower than the surface energy of the debris.
2. The method of claim 1 , wherein the tip coating is polytetrafluoroethylene.
3. The method of claim 1 , further comprising replenishing the tip coating by plunging the tip into the patch of material.
4. The method of claim 3 , wherein the replenishing step includes moving the tip laterally along the patch of material.
5. The method of claim 1 , further comprising using the patch to push the debris away from an apex of the tip and toward an atomic force microscope cantilever that supports the tip.
6. The method of claim 1 , wherein the tip coating is a metallic material.
7. A system for removing debris from a surface of a substrate, comprising:
an atomic force microscope, including:
a cantilever, and
a tip, supported by the cantilever, having a nanometer-scaled coating with a surface energy lower than the surface energy of the substrate; and
a patch of material, attached to a stage that supports the substrate, having a surface energy lower than the surface energy of the debris.
8. The system of claim 7 , wherein the tip coating is polytetrafluoroethylene.
9. The system of claim 7 , wherein the tip coating is a metallic material.
10. The system of claim 7 , wherein the patch of material is removably attached to the substrate stage.