Air duct flow optimization device

1. A device adapted to optimize air duct flow in an electronic system comprising a printed circuit board configured to support a plurality of electronic components having various heights, the device comprising:

an air duct comprising a rigid cross-sectional member, the air duct being adapted to facilitate air flow from an inlet port to an outlet port;

wherein the rigid cross-sectional member comprises an opening that is open to a direction perpendicular to the air duct flow and parallel to the printed circuit board having an interior perimeter, the interior perimeter of the opening being attached to a flexible sheet by a fastener;

wherein the rigid cross-sectional member attached to the flexible sheet is adapted to compress against at least one electronic component from the plurality of electronic components to the printed circuit board when the rigid cross-sectional member is mounted on the printed circuit board; and

wherein the rigid cross-section member is configured to form an enclosure that optimizes air duct flow.

2. The device according to claim 1 , wherein the opening of the rigid cross-sectional member is adapted to be disposed above and adjacent to at least one electronic component having a height greater than either of the electronic components disposed in a receiving area, the receiving area being a space on the printed circuit board configured to receive the rigid cross-sectional member when the air duct is mounted on top of the printed circuit board.

3. The device according to claim 1 , wherein a portion of the flexible sheet comprises a plurality of gaps adapted to be disposed above and adjacent to corresponding electronic components when the air duct is mounted on top of the printed circuit board.

4. The device according to claim 1 , wherein the flexible sheet is a Mylar sheet.

5. The device of claim 1 , wherein the fastener is a pressure sensitive adhesive.

6. A device adapted to optimize air duct flow in an electronic system comprising a printed circuit board configured to support a plurality of electronic components having various heights, the device comprising:

an air duct comprising a rigid cross-sectional member, the air duct being adapted to facilitate air flow from an inlet port to an outlet port;

wherein the rigid cross-sectional member comprises an opening having an interior perimeter, the interior perimeter of the opening being attached to a flexible sheet by a fastener;

wherein the rigid cross-sectional member attached to the flexible sheet is adapted to compress against at least one electronic component from the plurality of electronic components to the printed circuit board when the rigid cross-sectional member is mounted on the printed circuit board; and configured to form an enclosure that optimizes air duct flow; and

wherein the flexible sheet comprises a plurality of apertures, thereby dividing a portion of the flexible sheet into a plurality of sections of substantially equal heights; and wherein each of the sections of the flexible sheet are adapted to be disposed above and adjacent to corresponding electronic components when the air duct is mounted on top of the printed circuit board and each section comes into contact with corresponding electronic components.

7. A method for optimizing air duct flow in an electronic system comprising a printed circuit board, the printed circuit board being adapted to support a plurality of electronic components having various heights, the method comprising:

forming an air duct using a rigid cross-sectional member;

cutting out at least one portion of the rigid cross-sectional member to form an opening that is open to a direction perpendicular to the air duct flow and parallel to the printed circuit board having an interior perimeter;

attaching a flexible sheet to the interior perimeter of the opening with a fastener; and

compressing the rigid cross-sectional member attached to the flexible sheet against the printed circuit board to form an enclosure that optimizes air duct flow.

8. The method according to claim 7 , wherein cutting out at least one portion of the rigid cross-sectional member comprises cutting the opening to at least a height adapted to be disposed above and adjacent to at least one electronic component having a height greater than either of the electronic components disposed in a receiving area, the receiving area being a space on the printed circuit board configured to receive the rigid cross-sectional member when the air duct is compressed to the printed circuit board.

9. The method according to claim 7 , further comprising: forming a plurality of gaps in a portion of the flexible sheet, each of the plurality of gaps being adapted to be disposed above and adjacent to corresponding electronic components when the air duct is mounted on top of the printed circuit board.

10. The method of claim 7 , wherein the fastener is a pressure sensitive adhesive.

11. A method for optimizing air duct flow in an electronic system comprising a printed circuit board, the printed circuit board being adapted to support a plurality of electronic components having various heights, the method comprising:

forming an air duct using a rigid cross-sectional member;

cutting out at least one portion of the rigid cross-sectional member to form an opening having an interior perimeter;

attaching a flexible sheet to the interior perimeter of the opening with a fastener;

compressing the rigid cross-sectional member attached to the flexible sheet against the printed circuit board to form an enclosure that optimizes air duct flow; and

forming a plurality of apertures in the flexible sheet, thereby dividing a portion of the flexible sheet into a plurality of sections of substantially equal heights, each of the sections of the flexible sheet being adapted to be disposed above and adjacent to corresponding electronic components when the air duct is mounted on top of the printed circuit board and each section comes into contact with corresponding electronic components.

12. A sealing device comprising:

a rigid cross-sectional member attached to a flexible sheet by a fastener;

wherein the flexible sheet is adapted to be compressed against at least one electronic component of a plurality of electronic components mounted on a printed circuit board and configured to form an enclosure to optimize air duct flow; and

the sealing device further comprising an opening in the rigid cross-sectional member that is open to a direction perpendicular to the air duct flow and parallel to the printed circuit board, wherein the flexible sheet is attached to the opening with the fastener.

13. The sealing device according to claim 12 , wherein the opening of the rigid cross-sectional member is adapted to be disposed above and adjacent to at least one electronic component having a height greater than either of the electronic components disposed in a receiving area, the receiving area being a space on the printed circuit board configured to receive the rigid cross-sectional member when the air duct is mounted on the printed circuit board.

14. The sealing device according to claim 12 , wherein a portion of the flexible sheet comprises a plurality of gaps adapted to be disposed above and adjacent to corresponding electronic components when the air duct is mounted on top of the printed circuit board.

15. The sealing device according to claim 12 , wherein the flexible sheet is a Mylar sheet.

16. The sealing device according to claim 12 , wherein the fastener is a pressure sensitive adhesive.

17. A sealing device comprising:

a rigid cross-sectional member attached to a flexible sheet by a fastener;

wherein the flexible sheet is adapted to be compressed against at least one electronic component mounted on a printed circuit board and configured to form an enclosure to optimize air duct flow; and

wherein the flexible sheet comprises a plurality of apertures, thereby dividing a portion of the flexible sheet into a plurality of sections of substantially equal heights; and wherein each of the sections of the flexible sheet are adapted to be disposed above and adjacent to corresponding electronic components when the air duct is mounted on top of the printed circuit board and each section comes into contact with corresponding electronic components.