Semiconductor device and its wiring method
View Patent ↗A semiconductor device mounted on a mother board has a circuit board to be positioned on the mother board and a semiconductor chip positioned on the circuit board. The circuit board has a connection pad, a relay pad spaced away from the connection pad, and a wire connecting between the connection pad and the relay pad on a surface of the circuit board supporting the semiconductor chip. Also, the semiconductor chip has a connection pad corresponding to the connection pad formed on the circuit board. Further, the connection pad on the circuit board and the connection pad on the semiconductor chip are electrically connected to each other through a bonding wire.
1. A semiconductor device, comprising:
a circuit board having a first pad;
a first semiconductor chip mounted on said circuit board and having a second pad, a third pads and a connection wire electrically connecting the second and third pads;
a second semiconductor chip mounted on said first semiconductor chip and having a fourth pad,
a first connection member connecting the first pad and the second pad,
a second connection member connecting the third pad and fourth pad, wherein the connection wire is formed in said first semiconductor chip, and
the second pad is formed on a top surface of said first semiconductor chip and beside one edge of said first semiconductor chip while the third pad is formed on the top surface of said first semiconductor chip and beside another edge of said first semiconductor chip.
2. The semiconductor device according to claim 1 , wherein said first connection ember is a bonding wire jumping from the second pad over one edge of said first semiconductor chip and reaching the first pad, and
said second connection member is a bonding wire jumping from the fourth pad over one edge of the second semiconductor chip and reaching the third pad.
3. The semiconductor device according to claim 1 , wherein the connection wire is embedded in the first semiconductor chip.