IP Library Granted Patent US 7,654,113
Granted Patent B2
US 7,654,113 · App. 11/906,458 · Granted Feb 2, 2010

Apparatus for cooling a filament forming area of a filament forming apparatus

Assignee: OCV Intellectual Capital, LLC
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,654,113
App. No.
11/906,458
Granted
Feb 2, 2010
Kind
B2
Abstract

A cooling apparatus includes a manifold defining a fluid channel, and also includes a plurality of cooling fins connected to the manifold, wherein at least a portion of a surface of the fins includes porous material.

Claims (8)

1. A cooling apparatus for cooling a glass filament forming area beneath a bushing of a filament forming apparatus, the cooling apparatus comprising:

a manifold defining a fluid channel; and

a plurality of cooling fins connected to the manifold, wherein the fins include a groove formed on a fin surface.

2. The cooling apparatus according to claim 1 , wherein the groove is in fluid communication with the fluid channel of the manifold.

3. The cooling apparatus according to claim 1 , wherein each fin is substantially solid.

4. The cooling apparatus according to claim 3 , wherein the groove is in fluid communication with the fluid channel.

5. The cooling apparatus according to claim 1 , wherein each fin is formed from a substantially solid, non-porous material.

6. The cooling apparatus according to claim 5 , wherein the groove is in fluid communication with the fluid channel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2009
From: OWENS-CORNING FIBERGLAS TECHNOLOGY, INC.
To: OCV INTELLECTUAL CAPITAL, LLC
Reel/Frame 022804/0867 →
Continuity (2)
Division 1042648900 · Apr 30, 2003
Related Publication 20080127681A1 · Jun 5, 2008