LED of side view type and the method for manufacturing the same
View Patent ↗A side view type light emitting diode and a method of manufacturing the same are disclosed. The method may include (a) providing lead frames which include a cathode terminal and an anode terminal, (b) forming a reflector which surrounds the lead frames, such that portions of the cathode terminal and anode terminal protrude from both sides, and which includes a groove open in the upward direction and a wall surrounding the groove, (c) die-attaching an LED chip onto the lead frames inside the groove, (d) bonding the LED chip to the cathode terminal or to the anode terminal with a conductive wire, (e) dispensing a liquid curable resin into the groove to form a lens part and (f) sawing the walls facing each other using a sawing machine such that the thicknesses at the upper surfaces are about 0.04 mm to about 0.05 mm.
1. A method of manufacturing a side view type light emitting diode (LED), the method comprising:
(a) providing lead frames comprising a cathode terminal and an anode terminal;
(b) forming a reflector surrounding the lead frames such that portions of the cathode terminal and anode terminal protrude from both sides of the reflector, wherein a groove is defined in the reflector, wherein the reflector comprises a plurality of walls surrounding the groove, and wherein at least two walls of the groove face each other;
(c) die-attaching an LED chip on the lead frames inside the groove;
(d) bonding the LED chip to the cathode terminal or the anode terminal with a conductive wire;
(e) dispensing a liquid curable resin into the groove to form a lens array; and
(f) sawing the walls of the groove facing each other using a sawing machine.
2. The method of claim 1 , wherein the lead frames are formed by punching a copper (Cu) board plated with silver (Ag) using a press cast.
3. The method of claim 2 , wherein the lead frames comprise cutting-grooves on both side portions of outer ends of the cathode terminal and the anode terminal.
4. The method of claim 1 , wherein the reflector is formed by plastic injection molding.
5. The method of claim 4 , wherein the width of the groove is about 0.3 mm to about 0.35 mm.
6. The method of claim 1 , wherein an inner surface of the wall is inclined with respect to a bottom surface.
7. The method of claim 1 , wherein one of the (b) forming, the (c) die-attaching, and the (d) bonding comprises coating a reflective substance or joining a reflective plate of a metal material on an inner surface of the wall.
8. The method of claim 1 , wherein the liquid curable resin comprises a mixture of a fluorescent substance and liquid epoxy, the fluorescent substance selected according to the color of the LED chip.
9. The method of claim 1 , wherein the thicknesses of the walls at the upper surfaces are about 0.04 mm to about 0.05 mm.
10. The method of claim 1 , wherein the lens array is formed by curing liquid epoxy, and wherein the liquid epoxy comprises a fluorescent substance according to the color of the light emitted by the LED chip.