IP Library Granted Patent US 8,008,997
Granted Patent B2
US 8,008,997 · App. 11/907,048 · Granted Aug 30, 2011

Printed circuit board filter having rows of vias defining a quasi cavity that is below a cutoff frequency

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,008,997
App. No.
11/907,048
Granted
Aug 30, 2011
Kind
B2
Abstract

A low frequency reject filter element is formed on a printed circuit board that utilizes the fact that power transmission in a waveguide is cut-off below a certain frequency. A quasi waveguide cavity is formed in printed circuit board using the top and bottom ground plane of the stripline circuit and using conductive via holes to form the side walls of the cavity. Waveguide cavity mode is launched from the input and output striplines by shorting them to ground. Transformers and matching via hole elements may be used to improve matching. The resulting filter is compact and is highly effective in suppressing low frequency transmissions.

Claims (6)

1. A printed circuit board, comprising:

first and second substrates each defining an outer plane and an inner plane, the first and second substrates arranged together so respective inner planes face one another;

a first ground plane disposed on the outer plane of the first substrate;

a second ground plane disposed on the outer plane of the second substrate;

first and second conductive striplines sandwiched between the inner planes of the first and second substrates, each of the first and second striplines having a respective terminal end, the terminal ends of the first and second strips proximate to but not touching each other;

first and second rows of via holes arranged in a generally longitudinal direction of the striplines, the first row of via holes being arranged on one side of the striplines without touching the striplines and the second row of via holes being arranged on an opposing side of the striplines without touching the striplines, the first row of via holes and the second row of via holes electrically connecting the first ground plane to the second ground plane; whereby the combination of (1) the first ground plane near terminal ends of the first and second conductive striplines, (2) the second ground plane near the terminal ends of the first and second conductive striplines, and (3) the first row of via holes and the second row of via holes define a quasi cavity that prevents the passage of electromagnetic radiation below a cutoff frequency, wherein the printed circuit board is configured to receive an electromagnetic radiation signal of a particular frequency and the via holes of the first row of via holes and the via holes of the second row of via holes are spaced apart about 0.05 times a wavelength of the electromagnetic radiation signal between the first and second substrates at the particular frequency.

Assignments (2)
MERGER Recorded Jul 1, 2016
From: EXELIS INC.
To: HARRIS CORPORATION
Reel/Frame 039362/0534 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2012
From: ITT MANUFACTURING ENTERPRISES LLC (FORMERLY KNOWN AS ITT MANUFACTURING ENTERPRISES, INC.)
To: EXELIS INC.
Reel/Frame 028884/0186 →