Semiconductor laser device including a light shield plate, semiconductor laser device package, and methods of manufacturing the same
View Patent ↗Provided is a semiconductor laser device, a semiconductor laser device package including the semiconductor laser device and methods of manufacturing the same. A semiconductor laser device may include a light emission structure including a first clad layer, an active layer and a second clad layer sequentially deposited on a substrate, a submount to which the light emission structure bonded, and a light shield plate in the submount, wherein the light shield plate blocks an end of the substrate on a light emission face of the light emission structure and blocks light leaked through the end of the substrate.
1. A semiconductor laser device comprising:
a light emission structure including a first clad layer, an active layer, and a second clad layer sequentially deposited on a substrate;
a submount bonded to the light emission structure; and
a light shield plate in the submount, wherein the light shield plate blocks an end of the substrate on a light emission face of the light emission structure and blocks light leaked through the end of the substrate.
2. The semiconductor laser device of claim 1 , wherein the light shield plate blocks light leaked through the end of the substrate when the light emission structure is bonded to the submount.
3. The semiconductor laser device of claim 1 , wherein a portion of the second clad layer protrudes upward to form a ridge waveguide and the width of the light shield plate is greater than the width of the ridge waveguide.
4. The semiconductor laser device of claim 1 , wherein the light shield plate is formed of a material containing at least one of Si, SiC, SiN, AlN and metal substances.
5. The semiconductor laser device of claim 1 , wherein the substrate is one of a GaN substrate, a SiC substrate and a sapphire substrate.
6. The semiconductor laser device of claim 1 , wherein the first clad layer, the active layer, and the second clad layer are formed of Al x Ga 1-x In y N 1-y (0≦x≦0.3, 0≦y≦0.3).
7. The semiconductor laser device of claim 1 , wherein a gap is formed between the light shield plate and a light emission face of the light emission structure.
8. A semiconductor laser device package comprising:
a light emission structure including a first clad layer, an active layer, and a second clad layer sequentially deposited on a substrate;
a submount bonded to the light emission structure; a stem connected to the submount; and
a light shield plate formed in the stem to block an end of the substrate on a light emission face of the light emission structure and block light leaked through the end of the substrate.
9. The semiconductor laser device package of claim 8 , wherein a portion of the second clad layer protrudes upward to form a ridge waveguide and the width of the light shield plate is greater than the width of the ridge waveguide.
10. The semiconductor laser device package of claim 8 , wherein the substrate is one of a GaN substrate, a SiC substrate and a sapphire substrate.
11. The semiconductor laser device package of claim 8 , wherein the first clad layer, the active layer and the second clad layer are formed of Al x Ga 1-x In y N 1-y (0≦x≦0.3, 0≦y≦0.3).
12. The semiconductor laser device package of claim 8 , wherein a gap is formed between the light shield plate and the light emission face of the light emission structure.
13. A method of manufacturing a semiconductor laser device comprising:
depositing a light emission structure including a first clad layer, an active layer, and a second clad layer, respectively, on a substrate;
bonding a submount to the light emission structure; and
forming a light shield plate in the submount, wherein the light shield plate blocks an end of the substrate on a light emission face of the light emission structure and blocks light leaked through the end of the substrate.
14. The method of claim 13 , wherein the light shield plate blocks the light leaked through the end of the substrate when the light emission structure is bonded to the submount.
15. The method of claim 13 , wherein a portion of the second clad layer protrudes upward to form a ridge waveguide and the width of the light shield plate is greater than the width of the ridge waveguide.
16. The method of claim 13 , wherein the light shield plate is formed of a material containing at least one of Si, SiC, SiN, AlN and metal substances.
17. The method of claim 13 , wherein the substrate is one of a GaN substrate, a SiC substrate and a sapphire substrate.
18. The method of claim 13 , wherein the first clad layer, the active layer, and the second clad layer are formed of Al x Ga 1-x In y N 1-y (0≦x≦0.3, 0≦y≦0.3).
19. The method of claim 13 , wherein a gap is formed between the light shield plate and a light emission face of the light emission structure.
20. A method of manufacturing a semiconductor laser device package comprising:
depositing a light emission structure including a first clad layer, an active layer, and a second clad layer, respectively, on a substrate;
bonding a submount to the light emission structure;
forming a stem;
forming a light shield plate in the stem; and
connecting the submount to the stem,
wherein the light shield plate blocks an end of the substrate on a light emission face of the light emission structure and blocks light leaked through the end of the substrate.
21. The method of claim 20 , wherein a portion of the second clad layer protrudes upward to form a ridge waveguide and the width of the light shield plate is greater than the width of the ridge waveguide.
22. The method of claim 20 , wherein the substrate is one of a GaN substrate, a SiC substrate and a sapphire substrate.
23. The method of claim 20 , wherein the first clad layer, the active layer and the second clad layer are formed of Al x Ga 1-x In y N 1-y (0≦x≦0.3, 0≦y≦0.3).
24. The method of claim 20 , wherein a gap is formed between the light shield plate and the light emission face of the light emission structure.