IP Library Granted Patent US 8,021,910
Granted Patent B2
US 8,021,910 · App. 11/907,902 · Granted Sep 20, 2011

Method for producing single crystal silicon solar cell and single crystal silicon solar cell

Assignee: Shin-Etsu Chemical Co., Ltd.
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Quick Facts
Patent No.
US 8,021,910
App. No.
11/907,902
Granted
Sep 20, 2011
Kind
B2
Abstract

A method for producing a single crystal silicon solar cell including the steps of: implanting ions into a single crystal silicon substrate through an ion implanting surface thereof to form an ion implanted layer in the single crystal silicon substrate; forming a transparent electroconductive film on a surface of a transparent insulator substrate; conducting a surface activating treatment for the ion implanting surface of the single crystal silicon substrate and/or a surface of the transparent electroconductive film on the transparent insulator substrate; bonding the ion implanting surface of the single crystal silicon substrate and the surface of the transparent electroconductive film on the transparent insulator substrate to each other; applying an impact to the ion implanted layer; and forming a p-n junction in the single crystal silicon layer.

Claims (26)

1. A method for producing a single crystal silicon solar cell, the solar cell including a transparent insulator substrate and a single crystal silicon layer arranged over the transparent insulator substrate and acting as a light conversion layer, the method comprising at least the steps of:

preparing the transparent insulator substrate and a single crystal silicon substrate having a first conductivity type;

implanting at least one of hydrogen ions and rare gas ions into the single crystal silicon substrate through an ion implanting surface thereof to form an ion implanted layer in the single crystal silicon substrate;

forming a transparent electroconductive film on at least one surface of the transparent insulator substrate;

conducting a surface activating treatment for the ion implanting surface of the single crystal silicon substrate and/or a surface of the transparent electroconductive film on the transparent insulator substrate;

bonding the ion implanting surface of the single crystal silicon substrate and the surface of the transparent electroconductive film on the transparent insulator substrate to each other;

applying an impact to the ion implanted layer to mechanically delaminate the single crystal silicon substrate thereat to leave a single crystal silicon layer;

forming a diffusion layer having a second conductivity type in the single crystal silicon layer, which conductivity type is different from the first conductivity type, in a manner that a p-n junction is formed in the single crystal silicon layer; and

forming an electrode on the single crystal silicon layer.

2. The method for producing a single crystal silicon solar cell according to claim 1 , wherein the surface activating treatment is at least one of a plasma treatment and an ozone treatment.

3. The method for producing a single crystal silicon solar cell according to claim 1 , wherein the transparent insulator substrate is made of any one of quartz glass, crystallized glass, borosilicate glass, and soda-lime glass.

4. The method for producing a single crystal silicon solar cell according to claim 2 , wherein the transparent insulator substrate is made of any one of quartz glass, crystallized glass, borosilicate glass, and soda-lime glass.

5. The method for producing a single crystal silicon solar cell according to claim 1 , wherein the transparent electroconductive film is configured to contain at least one of titanium oxide, zinc oxide, tin oxide, and indium oxide, and a donor-forming additive.

6. The method for producing a single crystal silicon solar cell according to claim 2 , wherein the transparent electroconductive film is configured to contain at least one of titanium oxide, zinc oxide, tin oxide, and indium oxide, and a donor-forming additive.

7. The method for producing a single crystal silicon solar cell according to claim 3 , wherein the transparent electroconductive film is configured to contain at least one of titanium oxide, zinc oxide, tin oxide, and indium oxide, and a donor-forming additive.

8. The method for producing a single crystal silicon solar cell according to claim 4 , wherein the transparent electroconductive film is configured to contain at least one of titanium oxide, zinc oxide, tin oxide, and indium oxide, and a donor-forming additive.

9. The method for producing a single crystal silicon solar cell according to claim 1 , wherein the formation of the transparent electroconductive film is conducted by at least one of a reactive sputtering method, a reactive vapor deposition method, a CVD method, and a dip coating method.

10. The method for producing a single crystal silicon solar cell according to claim 2 , wherein the formation of the transparent electroconductive film is conducted by at least one of a reactive sputtering method, a reactive vapor deposition method, a CVD method, and a dip coating method.

11. The method for producing a single crystal silicon solar cell according to claim 3 , wherein the formation of the transparent electroconductive film is conducted by at least one of a reactive sputtering method, a reactive vapor deposition method, a CVD method, and a dip coating method.

12. The method for producing a single crystal silicon solar cell according to claim 4 , wherein the formation of the transparent electroconductive film is conducted by at least one of a reactive sputtering method, a reactive vapor deposition method, a CVD method, and a dip coating method.

13. The method for producing a single crystal silicon solar cell according to claim 5 , wherein the formation of the transparent electroconductive film is conducted by at least one of a reactive sputtering method, a reactive vapor deposition method, a CVD method, and a dip coating method.

14. The method for producing a single crystal silicon solar cell according to claim 6 , wherein the formation of the transparent electroconductive film is conducted by at least one of a reactive sputtering method, a reactive vapor deposition method, a CVD method, and a dip coating method.

15. The method for producing a single crystal silicon solar cell according to claim 7 , wherein the formation of the transparent electroconductive film is conducted by at least one of a reactive sputtering method, a reactive vapor deposition method, a CVD method, and a dip coating method.

16. The method for producing a single crystal silicon solar cell according to claim 8 , wherein the formation of the transparent electroconductive film is conducted by at least one of a reactive sputtering method, a reactive vapor deposition method, a CVD method, and, a dip coating method.

17. The method for producing a single crystal silicon solar cell according to claim 1 , wherein the ion implantation is conducted at a depth between 0.1 μm inclusive and 5 μm inclusive from the ion implanting surface.

18. The method for producing a single crystal silicon solar cell according to claim 16 , wherein the ion implantation is conducted at a depth between 0.1 μm inclusive and 5 μm inclusive from the ion implanting surface.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2007
From: ITO, ATSUO; AKIYAMA, SHOJI; KAWAI, MAKOTO; TANAKA, KOICHI; TOBISAKA, YUUJI; KUBOTA, YOSHIHIRO
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 020148/0043 →
Priority Claims (1)
JP 2006-294605 · Oct 30, 2006 · national
Continuity (1)
Related Publication 20080099065A1 · May 1, 2008