Board-to-board connector
View Patent ↗A thin board-to-board connector with high density in which there is no connection between three-dimensional complex metal springs. The board-to-board connector includes a connector having a bump for electrical connection having an umbrella shape on a board and connected to a circuit board and a connector having an elastic electrically conductive section having a through hole made in a conductive pattern on an elastic insulating board and connected to a circuit board electrically connected to the elastic conductive section. When a bump is inserted into the through hole, the elastic conductive section is electrically connected to the bump, and the side surface of the through hole is pressed against to the bump and elastically deformed and dented. Consequently, the bump is press-fit into the through hole. With this, the bump can be inserted into the elastic conductive section and engaged with it, and thereby electrical and mechanical connection between circuit boards can be simultaneously achieved in a two-dimensional manner, realizing a low-height connector.
1. A board-to-board connector for connecting circuit boards to each other comprising:
a first connector attached to one circuit board; and
a second connector attached to the other circuit board, wherein
the first connector includes a substrate of an insulative member having an umbrella-like conductive bump electrically connected to a circuit of the one circuit board,
the second connector includes a conductive pattern electrically connected to the other circuit board and an elastic substrate which is electrically connected to the conductive pattern and has an insertion hole capable of inserting the bump thereinto, and
both the circuit boards are electrically and mechanically connected to each other by inserting the bump into the insertion hole of the elastic substrate.
2. The board-to-board connector as stated in claim 1 , wherein
the elastic substrate is formed of a substrate with circuit and a conductive rubber filled into a groove and a through hole which are formed on the substrate with circuit to be integrally molded, and
the conductive pattern is formed of a circuit of the substrate and the conductive rubber.
3. The board-to-board connector as stated in claim 1 , wherein
the elastic substrate is formed of a substrate with circuit and a conductive rubber integrally molded on the substrate with circuit and in a through hole formed on the substrate, and
the conductive pattern is formed of a circuit of the substrate and the conductive rubber.
4. The board-to-board connector as stated in claim 1 , wherein
the elastic substrate is formed of a insulative substrate with circuit and a conductive rubber sheet which is joined to the substrate and on which a hole for inserting the bump thereinto is formed, and
the conductive pattern is formed of a circuit of the substrate and the conductive rubber sheet.
5. The board-to-board connector as stated in claim 4 , wherein
the conductive rubber sheet has a copper foil and the copper foil is joined to a joining pattern provided on the insulative substrate with circuit.