Surface-mount type optical semiconductor device and method for manufacturing the same
View Patent ↗A small and thin surface-mount type optical semiconductor device having high air tightness, which can be manufactured at a reduced cost includes: a base 2 formed of a glass substrate; a recess 5 formed on a first main surface 3 of the base; a through hole 7 extending from a bottom portion 4 of the recess to a second main surface 6 of the base; an inner wall conductive film formed on an inner wall surface of the through hole; a wiring pattern 9 made of a conductive film formed around an opening of the through hole on the bottom portion of the recess so as to be connected electrically to the inner wall conductive film; an optical semiconductor element 8 bonded to the wiring pattern via a conductive bonding material 14 ; a terminal portion 10 made of a conductive film formed around an opening of the through hole on the second main surface such that it is connected electrically to the inner wall conductive film; and a metal portion 13 bonded to the inner wall conductive film to clog the through hole.
1. A surface-mount type optical semiconductor device comprising:
a base formed of a glass substrate;
a recess fanned on a first main surface of the base;
a through hole that extends from a bottom surface of the recess to a second main surface of the base, forming a first opening at the bottom surface of the recess and a second opening at the second main surface of the base;
an inner wall conductive film that is formed on an inner wall surface of the through hole;
a wiring pattern that is made of a conductive film formed on the bottom surface of the recess at a region around the first opening of the through hole so as to be connected electrically to the inner wall conductive film;
an optical semiconductor element that is bonded to the wiring pattern via a conductive bonding material;
a terminal portion that is made of a conductive film formed on the second main surface at a region around the second opening of the through hole such that it is connected electrically to the inner wall conductive film; and
a metal portion that is filled into a bore of the through hole so as to be bonded to the inner wall conductive film to clog the through hole.
2. The surface-mount type optical semiconductor device according to claim 1 ,
wherein the wall surface of the recess forms a radial wall that extends radially outward from the bottom toward the surface, and
a reflective film is formed on the radial wall such that it is insulated from the wiring pattern.
3. The surface-mount type optical semiconductor device according to claim 2 ,
wherein, in the through hole, the second opening on the second main surface has a larger area than the flint opening on the bottom portion of the recess.
4. The surface-mount type optical semiconductor device according to claim 2 ,
wherein the recess is filled with a light transmissive resin.
5. The surface-mount type optical semiconductor device according to claim 2 ,
wherein a light transmissive lid that coven the recess is fixed on the first main surface.
6. The surface-mount type optical semiconductor device according to claim 1 ,
wherein, in the through hole, the second opening on the second main surface has a larger area than the first opening on the bottom surface of the recess.
7. The surface-mount type optical semiconductor device according to claim 6 ,
wherein the recess is filled with a light transmissive resin.
8. The surface-mount type optical semiconductor device according to claim 6 ,
wherein a light transmissive lid that coven the recess is fixed on the first main surface.
9. The surface-mount type optical semiconductor device according to claim 1 ,
wherein the recess is filled with a light transmissive resin.
10. The surface-mount type optical semiconductor device according to claim 1 ,
wherein a light transmissive lid that covers the recess is fixed on the first main surface.