Portable object connectable package
View Patent ↗A portable object connectable package for an electronic device comprises: semiconductor die package, having a top surface and an opposite bottom surface, and a connector body mechanically supported by the semiconductor die package. The bottom surface includes a plurality of connection elements for connecting to a printed circuit board. The connector body includes a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object PO having a contacting area. The portable object connectable package is arranged to be coupled to a portable object positioner for removably positioning the contacting area of the portable object in contact with the plurality of resilient electrical connecting elements when the portable object is present in the portable object positioner.
1. A portable object connectable package for an electronic device comprising:
a semiconductor die package comprising a top surface and an opposite bottom surface, the bottom surface comprising a plurality of connection elements for connecting to a printed circuit board; and
a connector body mechanically supported by the semiconductor die package and comprising a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object having a contacting area, wherein the portable object connectable package is arranged to be coupled to a portable object positioner for removably positioning the contacting area of the portable object in contact with the plurality of resilient electrical connecting elements when the portable object is present in the portable object positioner.
2. A portable object connectable package according to claim 1 , wherein the semiconductor die package comprises a semiconductor die, the connector body being electrically isolated from the semiconductor die.
3. A portable object connectable package according to claim 1 , wherein the plurality of resilient electrical connecting elements are electrically connected to the plurality of connection elements for connecting the printed circuit board to the semiconductor die package.
4. A portable object connectable package according to claim 1 , wherein the plurality of resilient electrical connecting elements are electrically connected to a bottom of the semiconductor die package through feed-through vias of the semiconductor die coupling the top surface to the bottom surface.
5. A portable object connectable package according to claim 1 , wherein the plurality of resilient electrical connecting elements comprises additional connectors for directly connecting to the printed circuit board.
6. A portable object connectable package according to claim 1 ,
wherein each resilient electrical connecting element of the plurality of resilient electrical connecting elements comprises a connecting lead, said connecting lead comprising a supporting portion mechanically supported by the top surface and a contacting portion protruding over the top surface.
7. A portable object connectable package according to claim 1 , wherein:
the semiconductor die package further comprises side surfaces extending substantially vertically between the top surface and the opposite bottom surface,
each resilient electrical connecting element of the plurality of resilient electrical connecting elements comprises a connecting lead, said connecting lead comprising a supporting portion mechanically supported by the side surface and a contacting portion protruding over the top surface.
8. A portable object connectable package according to claim 1 , wherein the resilient electrical connecting elements comprise first and second connecting leads, the first connecting lead facing the second connecting lead and extending substantially on half the length of the semiconductor die package.
9. A portable object connectable package according to claim 1 , wherein the resilient electrical connecting elements comprise first and second connecting leads, the first connecting lead being shifted from the second connecting lead, each connecting lead extending substantially on the entire length of the semiconductor die package.
10. A portable object connectable package according to claim 6 , wherein said connecting lead further comprises an intermediate portion between the supporting portion and the contacting portion, the intermediate portion being mechanically supported by the top surface.
11. A portable object connectable package according to claim 6 , wherein the contacting portion protrudes substantially diagonally from the supporting portion over the top surface.
12. A portable object connectable package according to claim 6 , wherein the contacting portion protrudes substantially diagonally from the intermediate portion over the top surface.
13. A portable object connectable package according to claim 6 , wherein the contacting portion further comprises a substantially crook-shaped distal part directed towards the top surface.
14. A portable object connectable package according to claim 6 , wherein the supporting portion comprises a massive part protruding laterally, said massive part comprising fins.
15. A portable object connectable package according to claim 1 , wherein the resilient electrical connecting elements comprise a thin laminate wrapped around a portion of the semiconductor die package, the thin laminate comprising an array of flexible contacts.
16. A portable object connectable package according to claim 1 , wherein the portable object positioner comprises a frame secured to the semiconductor die package and at least one abutment for limiting the movement of the portable object relatively to the connector body.
17. A portable electronic device comprising:
a printed circuit board;
a portable object positioner; and
a portable object connectable package including:
a semiconductor die package comprising a top surface and an opposite bottom surface, the bottom surface comprising a plurality of connection elements connected to the printed circuit board; and
a connector body mechanically supported by the semiconductor die package and comprising a plurality of resilient electrical connecting elements extending over the top surface for contacting with a portable object having a contacting area, wherein the portable object connectable package is arranged to be coupled to the portable object positioner for removably positioning the contacting area of the portable object in contact with the plurality of resilient electrical connecting elements when the portable object is present in the portable object positioner.
18. The portable electronic device of claim 17 , wherein the semiconductor die package comprises a semiconductor die, the connector body being electrically isolated from the semiconductor die.
19. The portable electronic device of claim 17 , wherein the plurality of resilient electrically connecting elements are electrically connected to the plurality of connection elements for connecting the printed circuit board to the semiconductor die package.
20. The portable electronic device of claim 17 , wherein the plurality of resilient electrical connecting elements are electrically connected to a bottom of the semiconductor die package through feed-through vias of the semiconductor die coupling the top surface to the bottom surface.
21. The portable electronic device of claim 17 , wherein the plurality of resilient electrical connecting elements comprises additional connectors for directly connecting to the printed circuit board.
22. The portable electronic device of claim 17 , wherein:
the semiconductor die package further comprises side surfaces extending substantially vertically between the top surface and the opposite bottom surface,
each resilient electrical connecting lead, said connecting lead comprising a supporting portion mechanically supported by the side surface and a contacting portion protruding over the top surface.
23. The portable electronic device of claim 17 , wherein the resilient electrical connecting elements comprise first and second connecting leads, the first connecting lead facing the second connecting lead and extending substantially on half the length of the semiconductor die package.
24. The portable electronic device of claim 17 , wherein the resilient electrical connecting elements comprise first and second connecting leads, the first connecting lead being shifted from the second connecting lead, each connecting lead extending substantially on the entire length of the semiconductor die package.
25. The portable electronic device of claim 17 , wherein each resilient electrical connecting element of the plurality of resilient electrical connecting elements comprises a connecting lead, said connecting lead comprising a supporting portion mechanically supported by the top surface and a contacting portion protruding over the top surface.
26. The portable electronic device of claim 25 , wherein said connecting lead further comprises an intermediate portion between the supporting portion and the contacting portion, the intermediate portion being mechanically supported by the top surface.
27. The portable electronic device of claim 25 , wherein the contacting portion protrudes substantially diagonally from the supporting portion over the top surface.
28. The portable electronic device of claim 25 , wherein the contacting portion protrudes substantially diagonally from the intermediate portion over the top surface.
29. The portable electronic device of claim 25 , wherein the contacting portion further comprises a substantially crook-shaped distal part directed towards the top surface.
30. The portable electronic device of claim 25 , wherein the supporting portion comprises a massive part protruding laterally, said massive part comprising fins.
31. The portable electronic device of claim 25 , wherein the resilient electrical connecting elements comprise a thin laminate wrapped around a portion of the semiconductor die package, the thin laminate comprising an array of flexible contacts.
32. The portable electronic device of claim 17 , wherein the portable object positioner comprises a frame secured to the semiconductor die package and at least one abutment for limiting the movement of the portable object relatively to the connector body.