Multilayer printed wiring board and manufacturing method thereof
View Patent ↗A multilayer printed wiring board is characterized in that the interlayer connection material in the via holes has a lower coefficient of thermal expansion in the thickness direction than the electrically insulating substrate made of insulating material; the interlayer connection is formed at a temperature higher than the operating temperature; and the interlayer connection material is larger in thickness than the interlayer connection material of the same wiring layer at normal temperature. This causes a difference in the coefficient of thermal expansion between the different materials in the thickness direction of the printed wiring board in the environment in which it is used resulting in high connection reliability.
1. A multilayer printed wiring board having a plurality of wiring layers, wherein
interlayer connection material in a via hole has a coefficient of thermal expansion in a thickness direction lower than a coefficient of thermal expansion in a thickness direction of an electrically insulating substrate made of insulating material and
the interlayer connection material is larger than the insulating material of a same wiring layer at the operating temperature in thickness; wherein
both sides of the interlayer connection material in the via hole are completely covered by wiring members formed on the insulating substrate.
2. The multilayer printed wiring board of claim 1 , wherein the insulating material is made of at least one of a composite of glass woven cloth and thermosetting resin; a composite of glass unwoven cloth and thermosetting resin; a composite of aramid woven cloth and thermosetting resin; and a composite of aramid unwoven cloth and thermosetting resin.
3. The multilayer printed wiring board of claim 2 , wherein the thermosetting resin is an epoxy-based resin.
4. The multilayer printed wiring board of claim 1 , wherein the thermoplastic resin has a glass transition temperature of at least 180° C.
5. The multilayer printed wiring board of claim 1 wherein
the insulating material is made of a film material.
6. The multilayer printed wiring board of claim 1 wherein
the interlayer connection material is formed by at least one of conductive pasting, conformal plating, filled plating, evaporating, and sputtering.
7. The multilayer printed wiring board of claim 1 , wherein the coefficient of thermal expansion in the thickness direction of the electrically insulating substrate is from 40 to 70 ppm/° C.