Solid-state image pickup element, method for manufacturing such solid-state image pickup element and optical waveguide forming device
View Patent ↗A solid-state imaging device of the present invention includes a base 13 , a plurality of photoelectric conversion portions 11 formed in a surface of the base 13 , and an insulating film 18 formed above the base 13 . Openings 18 h are formed in the insulating film 18 so that each of the openings 18 h is located above each of the photoelectric conversion portions 11 . Optical waveguides 19 having a refractive index higher than that of the insulating film 18 are formed in each of the openings 18 h . And the optical waveguides 19 are made of a composite material containing a resin 19 a and inorganic particles 19 b.
1. A method of manufacturing a solid-state imaging device, comprising steps of:
(i) forming an insulating film above a base that has a surface having a plurality of photoelectric conversion portions formed therein,
(ii) forming openings in the insulating film so that each of the openings is located above each of the photoelectric conversion portions,
(iii-a) disposing a mixture containing a material for making a composite material containing a resin and inorganic particles in the openings under an atmosphere of reduced pressure, and
(iii-b) filling up the openings with the mixture by increasing the pressure of the atmosphere.
2. The method according to claim 1 , wherein the pressure of the atmosphere in the step (iii-a) is in the range of 1 Pa to 100 Pa.
3. The method according to claim 1 , wherein, in the step (iii-a), the mixture is disposed in the openings by applying the mixture on the insulating film and conducting a spin coating.
4. The method according to claim 1 comprising, after the step (iii-b),
(iii-c) planarizing a surface of a film formed by the mixture and a surface of the insulating film.
5. The method according to claim 4 , wherein the planarizing in the step (iii-c) is performed by rotating the base.
6. The method according to claim 1 , wherein the material contains a raw material for the resin, and
the raw material contains one selected from a group consisting of a monomer, an oligomer and a precursor.
7. The method according to claim 6 , wherein the resin is a photocurable resin, and
the method further comprises a step of curing the mixture in the openings by photo-curing after the step (iii-b).
8. The method according to claim 6 , wherein the resin is a thermosetting resin, and
the method further comprises a step of curing the mixture in the openings by heat-curing after the step (iii-b).
9. The method according to claim 1 , wherein the resin is at least one resin selected from a group consisting of acrylic resin, epoxy resin, polyimide resin, butyral resin, non-crystal liquid polyolefin and polycarbonate resin.
10. The method according to claim 1 , wherein the length L of each of the openings and the width W of the bottom of each of the openings fulfill 1≦L/W≦5.
11. The method according to claim 1 , wherein the openings have a taper shape whose cross-sectional area gradually decreases from the surface side of the openings to the bottom side of the openings, and
an angle between a side wall of the openings and a surface of the base is 60° or more and less than 90°.
12. The method according to claim 1 , wherein the openings have a taper shape whose cross-sectional area gradually decreases from the surface side of the openings to the bottom side of the openings, and
an angle between a side wall of the openings and a surface of the base is 70° or more and 80° or less.