Multiple Component Electrical Contact
Electrical contact device, in particular for low-voltage switches and contactors, comprising a contact element produced in one piece. Said contact element comprises in particular a first conducting area and a second contact area, said first area and said second area being produced with materials of different types. The device according to the invention is suitably produced through a sintering process of at least two powders of conductive material of different types, in order to define in said contact element a first conducting area produced with a first of said powders, and a second contact area produced with a second of said powders.
1 . Electrical contact device, characterized in that it comprises a contact element ( 2 , 3 , 4 ) produced in one piece, said contact element ( 2 , 3 , 4 ) comprising a first conducting area ( 21 , 31 , 41 ) and a second contact area ( 22 , 32 , 42 ), said first area and said second area being produced with materials of different types.
2 . Electrical contact device as claimed in claim 1 , characterized in that said first conducting area ( 21 , 31 , 41 ) is substantially made of copper and said second contact area ( 22 , 32 , 42 ) is substantially made of silver.
3 . Electrical contact device as claimed in claim 1 , characterized in that the material with which said first conducting area ( 21 , 31 , 41 ) is produced comprises copper, and the material with which said second area ( 22 , 32 , 42 ) is produced comprises silver.
4 . Electrical contact device as claimed in claim 1 , characterized in that the material with which said second area ( 22 , 32 , 42 ) is produced comprises silver and tungsten carbide (WC), silver and nickel (Ag—Ni), silver and graphite (Ag—C), or silver and tungsten (Ag—W).
5 . Electrical contact device as claimed in claim 1 , characterized in that it comprises a conducting element connected to said contact element ( 2 , 3 , 4 ).
6 . Electrical contact device, characterized in that it comprises a contact element ( 2 , 3 , 4 ) produced in one piece through a sintering process of at least two powders of conductive materials of different types in order to define in said contact element ( 2 , 3 , 4 ) a first conducting area ( 21 , 31 , 41 ) produced with a first of said powders and a second contact area ( 22 , 32 , 42 ) produced with a second of said powders.
7 . Electrical contact device as claimed in claim 6 , characterized in that said first powder is substantially a copper based powder and said second powder is substantially a silver based powder.
8 . Electrical contact device as claimed in claim 6 , characterized in that said first powder is a mixture comprising a copper based powder and the second powder is a mixture comprising a silver based powder.
9 . Electrical contact device as claimed in claim 6 , characterized in that said first powder comprises copper, and said second powder comprises a mixture of silver and tungsten carbide (WC) powders.
10 . Electrical contact device as claimed in claim 6 , characterized in that it comprises a conducting element connected to the first conducting area ( 21 , 31 , 41 ) of said contact element ( 2 , 3 , 4 ), connection between said conducting element and said contact element ( 2 , 3 , 4 ) being produced during said sintering process.
11 . Process for preparing an electrical contact device characterized in that it comprises the following steps:
preparing a mold ( 5 , 6 , 7 ) to produce a contact element ( 2 , 3 , 4 ) of said device;
introducing a metered quantity of a first and a second powder into said mold ( 5 , 6 , 7 ), respectively in a first area ( 51 , 61 , 71 ) and in a second area ( 52 , 62 , 72 ) of said mold ( 5 , 6 , 7 );
closing said mold ( 5 , 6 , 7 ) and applying a temperature and a pressure suitable to carry out sintering of said first and second powder;
opening the mold and removing the contact element ( 2 , 3 , 4 ) thus produced.
12 . Process as claimed in claim 11 , characterized in that said first powder comprises a copper based powder and said second powder comprises a silver based powder.
13 . Process as claimed in claim 11 , characterized in that said second powder comprises a mixture of silver and tungsten based powders.
14 . Process as claimed in claim 11 , characterized in that said mold ( 5 , 6 , 7 ) is preheated prior to introduction of said powders.
15 . Process as claimed in claim 14 , characterized in that the preheating temperature is substantially the same as the temperature to carry out said sintering.
16 . Process as claimed in claim 11 , characterized in that said mold ( 5 , 6 , 7 ) is predisposed for the introduction of separators between said first area ( 51 , 61 , 71 ) and said second area ( 52 , 62 , 72 ).
17 . Process as claimed in claim 16 , characterized in that said separators are positioned prior to introduction of said powders and removed prior to carrying out said sintering.
18 . Process as claimed in claim 11 , characterized in that a conducting element of said electrical contact device is positioned in the mold ( 5 , 6 , 7 ) substantially at the level of said first area ( 51 , 61 , 71 ) prior to carrying out said sintering.
19 . Contact device produced with a process as claimed in claim 11 .
20 . Switch, particularly a low-voltage switch, comprising a contact device as claimed in claim 1 .
21 . Contactor, particularly a low-voltage contactor, comprising a contact device as claimed in claim 1 .