IP Library › Granted Patent US 7,888,434
Granted Patent B2
US 7,888,434 · App. 11/915,069 · Granted Feb 15, 2011

Aromatic polyamide and epoxy group-containing phenoxy resin

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Quick Facts
Patent No.
US 7,888,434
App. No.
11/915,069
Granted
Feb 15, 2011
Kind
B2
Abstract

A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.

Claims (4)

1. A polyamide resin composition comprising an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, the content of the epoxy group-containing phenoxy resin being 30 to 50% by mass.

2. A polyamide resin composition for injection molding, comprising the polyamide resin composition according to claim 1 .

3. The polyamide resin composition according to claim 1 , wherein the content of the epoxy group-containing phenoxy resin is 40 to 50% by mass.

4. A polyamide resin for injection molding, comprising the polyamide resin composition according to claim 3 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT SAFETY & CONSTRUCTION, INC.
Reel/Frame 051180/0648 →