Electronic component placement method
View Patent ↗In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.
1. An electronic component placement method comprising the steps of:
picking up electronic components from a plurality of component supply sections, each supplying electronic components, using a plurality of mounting heads which are provided corresponding to the respective component supply sections,
transferring the electronic components in a same placing stage using the mounting heads; and
mounting the electronic components on a substrate in a same placing stage,
wherein in performing the component transferring and mounting operations using the mounting heads, in the placing stage, processing for setting an exclusive operating region which allows an access of only specific mounting heads out of the plurality of mounting heads is executed,
wherein the setting of the exclusive operating region is performed, for each placing turn in which the mounting heads perform one reciprocating motion in the component transferring and mounting operation, based on component mounting position information in each placing turn.
2. An electronic component placement method according to claim 1 , wherein one mounting head out of the plurality of mounting heads is retracted after finishing the mounting of components within the exclusive operating region and, thereafter, another mounting head out of the plurality of mounting heads progresses into the inside of the exclusive operating region.
3. An electronic component placement method according to claim 1 , wherein the exclusive operating region is set for each mounting head in the plurality of mounting heads, and the presence or the non-presence of the interference of the mounting head with another mounting head is determined, and when it is determined that there is no interference, each mounting head progresses on the substrate and places the electronic component.
4. An electronic component placement method according to claim 1 , wherein the setting of the exclusive operating region is performed so that a width of the exclusive operating region in a direction perpendicular to a direction of transferring the electronic components differs based on the component mounting position information.
5. An electronic component placement method according to claim 1 , wherein the setting of the exclusive operating region is performed so that a width of the exclusive operating region in a direction perpendicular to a direction of transferring the electronic components differs for the each placing turn based on the component mounting position information.
6. An electronic component placement method according to claim 1 , wherein the setting of the exclusive operating region is performed so that a width of the exclusive operating region is smaller than a width of the substrate in a direction perpendicular to a direction of transferring the electronic components.
7. An electronic component placement method according to claim 6 , wherein the setting of the exclusive operating region is performed so that a width of the exclusive operating region differs based on component mounting position information of substrates which are transferred to the placing stage for respective kinds of the substrates.
8. An electronic component placement method according to claim 6 , wherein the setting of the exclusive operating region is performed so that a width of the exclusive operating region differs for each placing turn in which the mounting heads perform one reciprocating motion in the component transferring and mounting operation.
9. An electronic component placement method according to claim 1 , wherein the electronic components are mounted on a substrate positioned on a single transporting passage in the same placing stage using the plurality of mounting heads.
10. An electronic component placement method according to claim 1 , wherein the setting of the exclusive operating region is performed based on component mounting position information of substrates which are transferred to the placing stage for respective kinds of the substrates.
11. An electronic component placement method according to claim 1 , wherein the exclusive operating region differs for every placing turn in which the mounting heads perform one reciprocating motion in the component transferring and mounting operation.