Noncontact information storage medium and method for manufacturing same
View Patent ↗A non-contact information storage medium has IC chip having at least a function of storing information, and resin substrate having antenna pattern for communicating a signal to an external device. Antenna terminal disposed at one end of antenna pattern on resin substrate and electrode terminal of IC chip are mounted so that the antenna terminal faces the electrode terminal. Insulating layer for gap regulation of at least 5 μm is disposed between antenna pattern and circuit forming surface of IC chip.
1. A non-contact information storage medium comprising:
an IC chip having a function of storing information and processing a signal, the IC chip having electrode terminals disposed on a circuit surface of the IC chip;
a resin substrate made of a base material having thermoplasticity, the resin substrate having an antenna pattern for communicating a signal to an external device, the antenna pattern having antenna terminals at respective ends of the antenna pattern;
an insulating layer for gap regulation disposed on the resin substrate between the antenna terminals, the insulating layer having a thickness that is greater than thickness of the antenna terminals by 5 μm or greater and is less than the sum of height of a bump disposed on a surface of the electrode terminal of the IC chip and thickness of the antenna terminal; and
anisotropic conductive resin or insulating resin, which is different from the insulating layer, for coupling the bump disposed on the electrode terminal to the antenna terminals, wherein:
the antenna terminals disposed on the resin substrate and the electrode terminal of the IC chip are mounted so that the antenna terminal faces the electrode terminal, and
a gap of at least 5 μm is disposed between the antenna pattern and the circuit surface of the IC chip.
2. The non-contact information storage medium of claim 1 , wherein
the insulating layer for gap regulation is made of one of thermosetting resin material, thermoplastic resin material, ultraviolet cured resin, and a mixture of them.
3. A manufacturing method of the non-contact information storage medium, the method comprising:
a sticking step of sticking a hard plate with a shape at least larger than area of the plurality of antenna terminals to a surface facing a surface mounted with the IC chip of the base material in the resin substrate;
a resin supplying step of supplying one of insulating adhesive resin and anisotropic conductive resin onto an antenna terminal of a resin substrate, an antenna pattern being formed on a polyester base material in the resin substrate;
an aligning step of arranging an IC chip having a bump on the resin substrate and aligning the bump and antenna terminal, the bump having a thickness of 5 μm or greater and being formed on a surface of an electrode terminal;
a mounting step of pressing and heating the IC chip, and electrically coupling the bump to the antenna terminal in a direct contact manner or via the anisotropic conductive resin;
a hardening step of hardening one of the insulating adhesive resin and the anisotropic conductive resin; and
a removing step of removing the hard plate,
wherein applied pressure in the mounting step and the hardening step is set in a range from 0.5 MPa to 2.5 MPa.
4. The manufacturing method of the non-contact information storage medium of claim 3 , wherein:
the IC chip has a circuit forming surface on which an analog circuit and a ground circuit n electrode terminal disposed on a circuit surface of the IC chip, and
the IC chip has an insulating layer disposed on the circuit forming surface, the insulating layer having a thickness that is 5 μm or greater and is less than height of the bump formed on the surface of the electrode terminal of the IC chip.
5. The manufacturing method of the non-contact information storage medium of claim 3 , wherein:
the antenna terminal includes two antenna terminals, and
the insulating layer is disposed between the two antenna terminals, the insulating layer having a thickness that is less than the sum of height of the bump of the IC chip and thickness of the antenna terminals.
6. The manufacturing method of the non-contact information storage medium of claim 3 , wherein:
the insulating layer is disposed on the antenna pattern including the antenna terminal and on a region overlaid on the IC chip, and
the insulating layer having a thickness that is 5 μm or greater and is less than height of the bump formed on the surface of the electrode terminal of the IC chip.